2002
DOI: 10.21236/ada403236
|View full text |Cite
|
Sign up to set email alerts
|

Cycle Life Enhancement in Cu-Sn Anodes

Abstract: This technical report summarizes the work on two different approaches that have been used to increase the cycle life of active-inactive composites in the copper-tin system. The first approach is to reduce the particle size of the active-inactive composities to the nano-scale (<100 nm). The second approach is the addition of extra elements that segregate to grain/phase boundaries and increase the cohesive strength of the boundary. Both approaches significantly improved the capacity retention of a Cu6Sn5 alloy. … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 17 publications
(25 reference statements)
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?