Abstract:Cyanate ester resins are widely utilized in high-performance printed circuit board, radar radome, communication satellite, and other fields. However, the poor toughness after curing due to the highly cross-linked and...
“…58 The curing activation energies E can be calculated by the Kissinger method, which has been found to be the most convenient approach to calculate the kinetic parameters of thermal degradation processes. 59 Figure 10.TGA curves of PAEK-C/epoxy resins at different heating rates (a) P0, (b) P5, (c) P10, (d) P20, (e) P25, (f) P30, and (g) P100.…”
Section: Resultsmentioning
confidence: 99%
“…58 The curing activation energies E can be calculated by the Kissinger method, which has been found to be the most convenient approach to calculate the kinetic parameters of thermal degradation processes. 59 Assuming that heat flow relative to the instrumental baseline is proportional to the cure reaction rate (dα/dt). 10 The classical reaction kinetics equation is expressed as…”
Current research work focuses on the tribological and thermal properties of epoxy resin matrix composites, which were modified by polyaryletherketone (PAEK-C). The results of the infrared spectra and morphologies of fracture surfaces experiments corroborate the successful synthesis of the materials. From the tribological experiments, it can be known that when the mass fraction of PAEK-C was 10 phr., the corresponding composite exhibited the outstanding wear performances, which could be ascribed to the higher H/E ratio. Based on the results of tribological experiments, it could be obtained that the main wear mechanism is governed by combination of the plastic deformation, creation of vertical cracks in the sliding track, separation of debris, and material waves due to adhesions. In addition, the glass transition temperatures ( Tg) and heat-resistance index ( THRI) of the PAEK-C/epoxy resin higher than those of pure epoxy resin matrix, respectively. Furthermore, when the mass fraction of PAEK-C increased, the heat resistance index ( THRI) of the corresponding composite is 196.3°C, which is higher than that of neat epoxy resin (180.9°C). Also, according to the results of thermogravimetric analysis experiments, it could conclude that the activation energy of the curing process is situated in the range of 150–160 kJ mol−1 depending on the mass fraction of epoxy resins.
“…58 The curing activation energies E can be calculated by the Kissinger method, which has been found to be the most convenient approach to calculate the kinetic parameters of thermal degradation processes. 59 Figure 10.TGA curves of PAEK-C/epoxy resins at different heating rates (a) P0, (b) P5, (c) P10, (d) P20, (e) P25, (f) P30, and (g) P100.…”
Section: Resultsmentioning
confidence: 99%
“…58 The curing activation energies E can be calculated by the Kissinger method, which has been found to be the most convenient approach to calculate the kinetic parameters of thermal degradation processes. 59 Assuming that heat flow relative to the instrumental baseline is proportional to the cure reaction rate (dα/dt). 10 The classical reaction kinetics equation is expressed as…”
Current research work focuses on the tribological and thermal properties of epoxy resin matrix composites, which were modified by polyaryletherketone (PAEK-C). The results of the infrared spectra and morphologies of fracture surfaces experiments corroborate the successful synthesis of the materials. From the tribological experiments, it can be known that when the mass fraction of PAEK-C was 10 phr., the corresponding composite exhibited the outstanding wear performances, which could be ascribed to the higher H/E ratio. Based on the results of tribological experiments, it could be obtained that the main wear mechanism is governed by combination of the plastic deformation, creation of vertical cracks in the sliding track, separation of debris, and material waves due to adhesions. In addition, the glass transition temperatures ( Tg) and heat-resistance index ( THRI) of the PAEK-C/epoxy resin higher than those of pure epoxy resin matrix, respectively. Furthermore, when the mass fraction of PAEK-C increased, the heat resistance index ( THRI) of the corresponding composite is 196.3°C, which is higher than that of neat epoxy resin (180.9°C). Also, according to the results of thermogravimetric analysis experiments, it could conclude that the activation energy of the curing process is situated in the range of 150–160 kJ mol−1 depending on the mass fraction of epoxy resins.
“…As a high performance resin, CE resins are widely used in high performance radome, electronic packaging materials, aerospace industry, and other fields due to their excellent thermal properties, dielectric properties, flame retardancy, and low water absorption 1,2 . However, CE resin has a fatal defect in that the curing temperature is very high, above 300°C, which cannot meet the industrial demands 3,4 .…”
In the current study, three different curing kinetics models were used to analyze the curing kinetics of hyperbranched benzoxazine (HB‐PED230) and monofunctional benzoxazine (P‐a) modified cyanate ester (CE) resin by non‐isothermal differential scanning calorimeter. Moreover, the effects of two benzoxazines on the copolymerization behavior, thermal stability, and mechanical properties of CE resin were studied. Compared with the P‐a modified CE resin, HB‐PED230 greatly reduces the curing temperature of the copolymer, while improving the bending strength and impact strength. The curing temperature of HB‐PED230 modified CE resin was 79°C lower than neat CE resin, while the CE/P‐a blended resin only reduce 48°C. As the amount of HB‐PED230 increased, the flexural strength and flexural modulus of the copolymers were improved. Surprisingly, when 7 wt% of HB‐PED230 was added, the impact strength of the copolymer was increased by 177.6%, implying that the toughness of CE resin had been greatly improved. Moreover, the fracture morphology of the copolymers was observed by scanning electron microscope. In summary, a small amount of HB‐PED230 blending can effectively improve the overall performance of CE resin.
“…[1] At present, there are many polymers used in low-k materials research, such as polyimide, [2] polybenzoxazole, [3] polybenzoxazine, [4] and cyanate ester. [5] Polybenzoxazine is a kind of high-performance thermosetting resin with flexible molecular design, [6] low water absorption, [7] good thermal and mechanical properties, [8] high flame retardancy, [9] DOI: 10.1002/mame.202100747 and good dielectric properties. [10] Zhang et al [11] designed a new family of polybenzoxazine resins with ortho-maleimide functionality, which possessed good processability and low dielectric constant.…”
Section: Introductionmentioning
confidence: 99%
“…[ 1 ] At present, there are many polymers used in low‐ k materials research, such as polyimide, [ 2 ] polybenzoxazole, [ 3 ] polybenzoxazine, [ 4 ] and cyanate ester. [ 5 ] Polybenzoxazine is a kind of high‐performance thermosetting resin with flexible molecular design, [ 6 ] low water absorption, [ 7 ] good thermal and mechanical properties, [ 8 ] high flame retardancy, [ 9 ] and good dielectric properties. [ 10 ] Zhang et al.…”
In this work, a bio-based benzoxazine monomer (C-s) is synthesized from cardanol, stearylamine, and paraformaldehyde through solvent-free method. Pyrogallol is used as a curing catalyst for the ring-opening polymerization of benzoxazine. Differential scanning calorimeter (DSC) results reveal that doping with pyrogallol reduces the exothermic peak temperature (T p ) of C-s from 256 to 174 °C. The polybenzoxazine/pyrogallol/polyhedral oligomeric silsesquioxane (PC-s/py/POSS) nanocomposites are prepared via thermal curing. The doping of aminopropyl isobutyl POSS (POSS-NH 2 ) can reduce the dielectric constant of polybenzoxazine. The dielectric constant of PC-s/py/POSS is 2.64 at 1 MHz when the doping amount of POSS-NH 2 is 10 wt%. The results of thermogravimetric analysis (TGA) and water absorption test indicate that the PC-s/py/POSS nanocomposites possess good thermal stability and water resistance. In summary, the PC-s/py/POSS nanocomposites with low curing temperature and low dielectric constant are expected to be applied to the low dielectric materials for microelectronic applications.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
