Cutting force–based analysis and correlative observations on the tool wear in diamond turning of single-crystal silicon

Wang, Chao; Cheng, Kai; Nelson, Nicholas; Sawangsri, Worapong; Rakowski, R.T.

doi:10.1177/0954405414543316

Cited by 21 publications

(14 citation statements)

References 14 publications

(14 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…There are two broad classifications of diamond, the main features of which are shown in table X. [148] used wavelet transform method to decompose the cutting force signals for real-time tool condition monitoring with a notion that a good understanding of the wear mechanism is an essential step for identifying the measures needed to suppress wear and to enhance the usefulness of tool life.…”

Section: Wear Of Diamond Cutting Tools During Machining Of Siliconmentioning

confidence: 99%

“…The tangential force causes displacements in the direction of cut chip thickness and its variation therefore relates to chatter. These are the reasons why cutting force measurement is an important indicator of tool wear[148]. From the MD simulation perspective, the calculation of the cutting forces using a diatomic pair potential, such as Morse or Lennard Jones function is relatively simpler because the interaction energy will include a pair component which is defined as the pairwise energy between all pairs of atoms where one atom in the pair is in the first group (workpiece) and the other is in the second group (cutting tool).…”

mentioning

confidence: 99%

See 1 more Smart Citation

Diamond machining of silicon: A review of advances in molecular dynamics simulation

Goel¹,

Luo

Agrawal

et al. 2015

International Journal of Machine Tools and Manufacture

344

111

View full text Add to dashboard Cite

Molecular Dynamics (MD) simulation has enhanced our understanding about ductile-regime machining of brittle materials such as silicon and germanium. In particular, MD simulation has helped understand the occurrence of brittle-ductile transition due to the high-pressure phase transformation (HPPT), which induces Herzfeld-Mott transition. In this paper, relevant MD simulation studies in conjunction with experimental studies are reviewed with a focus on (i) The importance of machining variables: undeformed chip thickness, feed rate, depth of cut, geometry of the cutting tool in influencing the state of the deviatoric stresses to cause HPPT in silicon, (ii) The influence of material properties: role of fracture toughness and hardness, crystal structure and anisotropy of the material, and (iii) Phenomenological understanding of the wear of diamond cutting tools, which are all non-trivial for cost-effective manufacturing of silicon. The ongoing developmental work on potential energy functions is reviewed to identify opportunities for overcoming the current limitations of MD simulations. Potential research areas relating to how MD simulation might help improve existing manufacturing technologies are identified whichmay be of particular interest to early stage researchers.

show abstract

Section: Wear Of Diamond Cutting Tools During Machining Of Siliconmentioning

confidence: 99%

mentioning

confidence: 99%

Diamond machining of silicon: A review of advances in molecular dynamics simulation

Goel¹,

Luo

Agrawal

et al. 2015

International Journal of Machine Tools and Manufacture

344

111

View full text Add to dashboard Cite

show abstract

“…The increase in temperature causes the silicon material to soften and directly causes a reduction in cutting force. Cutting force [40] measurement is an important indicator of nano-cutting behavior. Figure 13 represents average tangential forces (X) and normal forces (Y) calculated with respect to seven different adjustment angles.…”

Section: Cutting Forcementioning

confidence: 99%

Effect of dynamic adjustment of diamond tools on nano-cutting behavior of single-crystal silicon

et al. 2019

View full text Add to dashboard Cite

A new method for adjusting the tool rake and flank angles by changing the position of the tools was used to dynamic explore the nano-cutting behavior of single-crystal silicon using MD simulation. Simulations under the same cutting conditions were carried out using a tool swinging to six different rake angles of − 10°, − 15°, − 20°, − 25°, − 30°, − 35°, and − 45°. The advantages of Tersoff potential function are discussed in comparison with those of using SW potential function. The coordination number, von Mises stress, hydrostatic stress, system temperature, potential energy and cutting force during the nano-cutting process are studied. The results of a statistical study reveal that the coordination numbers of silicon atoms showed a minimum value and the highest average hydrostatic stress at − 25° adjustment angle. Besides, the maximum system potential energy and temperature is also obtained at an adjustment angle of − 25° after − 20° (it can be defined as a larger adjustment angle after − 15°). In addition, the results also point out that the highest average tangential force was observed at − 25°, which is different from the previous researches.

show abstract

“…(1) Protecting and enhancing the tool when the measured force is greater than the reference force; (2) Maintaining high productivity when the measured force is less than the reference force, and; (3) The improved reliability of the smart cutting tools in smart machining applications [25]. Figure 18(a) illustrates a block diagram of a CNC machine with adaptive control, where the adaptive control process is based on the smart cutting tool in-process measuring cutting force.…”

Section: Smart Machining -Application Exemplarsmentioning

confidence: 99%

Smart Cutting Tools and Smart Machining: Development Approaches, and Their Implementation and Application Perspectives

Cheng

Niu

Wang

et al. 2017

Chin. J. Mech. Eng.

Self Cite

View full text Add to dashboard Cite

Smart machining has tremendous potential and is becoming one of new generation high value precision manufacturing technologies in line with the advance of Industry 4.0 concepts. This paper presents some innovative design concepts and, in particular, the development of four types of smart cutting tools, including a force-based smart cutting tool, a temperature-based internally-cooled cutting tool, a fast tool servo (FTS) and smart collets for ultraprecision and micro manufacturing purposes. Implementation and application perspectives of these smart cutting tools are explored and discussed particularly for smart machining against a number of industrial application requirements. They are contamination-free machining, machining of tool-wear-prone Si-based infra-red devices and medical applications, high speed micro milling and micro drilling, etc. Furthermore, implementation techniques are presented focusing on: (a) plug-and-produce design principle and the associated smart control algorithms, (b) piezoelectric film and surface acoustic wave transducers to measure cutting forces in process, (c) critical cutting temperature control in real-time machining, (d) inprocess calibration through machining trials, (e) FE-based design and analysis of smart cutting tools, and (f) application exemplars on adaptive smart machining.

show abstract

Cutting force–based analysis and correlative observations on the tool wear in diamond turning of single-crystal silicon

Cited by 21 publications

References 14 publications

Diamond machining of silicon: A review of advances in molecular dynamics simulation

Diamond machining of silicon: A review of advances in molecular dynamics simulation

Effect of dynamic adjustment of diamond tools on nano-cutting behavior of single-crystal silicon

Smart Cutting Tools and Smart Machining: Development Approaches, and Their Implementation and Application Perspectives

Contact Info

Product

Resources

About