2022
DOI: 10.1109/led.2021.3126842
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Cut-Off Degradation of Output Current Induced by High Fluence Neutron Radiation in High-Voltage Silicon-on-Insulator Lateral Double-Diffused MOSFET

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Cited by 3 publications
(3 citation statements)
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“…Chemical etching was used to reduce the thickness of the natural SiO 2 layer (between the metal and the semiconductor) and prepare the surface for the formation of metal contacts. It should be noted that this SiO 2 dielectric layer was not purposefully grown, as compared to MOSFET technology [13,19,22,30]. It still exists even after the chemical etching of the silicon samples in HF+HNO 3 acid solution.…”
Section: Methodsmentioning
confidence: 99%
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“…Chemical etching was used to reduce the thickness of the natural SiO 2 layer (between the metal and the semiconductor) and prepare the surface for the formation of metal contacts. It should be noted that this SiO 2 dielectric layer was not purposefully grown, as compared to MOSFET technology [13,19,22,30]. It still exists even after the chemical etching of the silicon samples in HF+HNO 3 acid solution.…”
Section: Methodsmentioning
confidence: 99%
“…However, technological operations of the manufacturing of electronic devices [17][18][19], operating under extreme external fields [20][21][22][23][24], can stimulate the creation of defect complexes based on point defects (e.g., vacancies and interstitial silicon atoms) [25][26][27] and their further interaction and clustering [28,29].…”
Section: Introductionmentioning
confidence: 99%
“…Тому за останні декілька десятиліть накопичилось значна кількість наукових публікацій присвячених дослідженню його властивостей. Технологічні операції виготовлення електронних пристроїв [1][2][3], експлуатація в екстремальних зовнішніх полях [4][5][6] можуть стимулювати створення внутрішніх дефектних комплексів на онові власних точкових дефектів (вакансій та міжвузлових атомів кремнію) [7] та їх подальшу взаємодію та кластеризацію [8].…”
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