2006
DOI: 10.1016/j.jneumeth.2005.08.021
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Custom-designed high-density conformal planar multielectrode arrays for brain slice electrophysiology

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Cited by 44 publications
(40 citation statements)
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“…Two groups, each containing 14 microelectrodes, were fabricated on each substrate; the radii of the microelectrodes were 11, 25, 50, 150, 175, 200, 225, 250, 275, 300, and 325 μm. The details of the two photomask microfabrication process flow are described elsewhere [18]. The trace length was kept constant (26±1.5 mm) for all electrodes and the associated resistance of the platinum traces was 81.0 ± 1.6 Ω.…”
Section: Methodsmentioning
confidence: 99%
“…Two groups, each containing 14 microelectrodes, were fabricated on each substrate; the radii of the microelectrodes were 11, 25, 50, 150, 175, 200, 225, 250, 275, 300, and 325 μm. The details of the two photomask microfabrication process flow are described elsewhere [18]. The trace length was kept constant (26±1.5 mm) for all electrodes and the associated resistance of the platinum traces was 81.0 ± 1.6 Ω.…”
Section: Methodsmentioning
confidence: 99%
“…Details of the two photomask photolithographic process flow for fabrication of MEAs with Pt leads and silicon nitride/SU-8 insulation are described elsewhere [34], [35].…”
Section: B Custom Multielectrode Arraysmentioning
confidence: 99%
“…60 R 64 R ITO tracks with Ø 28 -36 µm or 36 x 36 µm 2 Au-or Pt-coated electrodes on glass in a tissue-"conformal" arrangement, insulated by Si 3 N 4 or SU-8 (Gholmieh et al, 2006) (Giovangrandi et al, 2006) S. Rajaraman M.G. Allen et al 12 -13 R (3D) Laser scribed, electroplated Ni/Cu/Pt-black electrodes (Ø < 10 µm) on a SU-8 microtower (fluidic) structure (< 500 µm height) on perforated fused silica insulated by parylene (Rajaraman et al, 2007) 25 R (spike, 3D) + 25 R (planar) 300 -500 µm high, Ø 50 µm Au/Cr spike-tip or Ø 50 µm Au planar electrodes through metal transfer micromolding (MTM) in PDMS on SU-8, PMMA, or PU carrier with parylene insulator either selectively laser-and globally RIE-(CHF 3 /O 2 plasma) deinsulated at the electrode sites, or applied during "capping protection" of the electrode sites.…”
Section: R+49smentioning
confidence: 99%