“…The nature of the I – V characteristics may alter depending on the contact metals , annealing temperature , surface passivation , thickness , and orientation of the nanostructures. A plethora of conflicting mechanisms have been discussed to explain the electrical transport mechanisms through a disordered array of Si nanostructures, namely band conduction , Pool–Frenkel (PF) emission , trap‐assisted tunneling (TAT) , trap‐controlled space charge limited conduction (TCSCLC) , Fowler Nordheim (FN) tunneling , thermionic emission, thermally activated hopping , variable range hopping , inter‐crystal hopping , Schottky barrier , etc. Besides the switching operation , other fundamental and important features, like very high switching speed (sub‐ns), excellent memory characteristics, ultra low power consumption and most importantly, compatibility with the existing Si technology, makes Si‐SiO x ‐based RRAM potential candidate for next generation memory device.…”