1996
DOI: 10.1109/55.545780
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Current transport characteristics of SiGeC/Si heterojunction diode

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Cited by 11 publications
(4 citation statements)
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“…As refer to Table 2, Io increases with increasing temperature while n decreases. Similar results for p-n junctions have been reported for several studies [8,[20][21][22][23]. The values of n are quite large according to an ideal p-n junction.…”
Section: Resultssupporting
confidence: 88%
“…As refer to Table 2, Io increases with increasing temperature while n decreases. Similar results for p-n junctions have been reported for several studies [8,[20][21][22][23]. The values of n are quite large according to an ideal p-n junction.…”
Section: Resultssupporting
confidence: 88%
“…6 Experimentally, most HJs have the following general formulations for the current density 17 J = J 00 exp(-∆E/kT)[exp(qV/ηkT) -1] where J 00 is the saturation reverse current, η is the ideality factor, and ∆E is a measured activation en- Note: Mean surface roughness measured by AFM. 18 Due to large valence band offsets, 15 we conclude that the electrons inject from the wider gap n-Si to the p + -GeC or SiGeC layer. Activation energy for the zero bias extrapolation of the lnJ vs V curves was obtained from an Arrhenius plot for different temperature.…”
Section: Influence Of Carbon On I-v Characteristics Of Sigec/si and Gmentioning
confidence: 94%
“…Mesa diodes with a junction area of 0.2 mm and a light sensitive area (not shaded by the contacts) of 0.182 mm were fabricated using photolithography and wet chemical etching [8]. Electrical contacts of Ti-Au metal were thermally evaporated to a thickness of 60 nm/300 nm, respectively, as shown in the inset to Fig.…”
Section: A Device Fabricationmentioning
confidence: 99%