Extended Abstracts of the 2010 International Conference on Solid State Devices and Materials 2010
DOI: 10.7567/ssdm.2010.e-7-1
|View full text |Cite
|
Sign up to set email alerts
|

Current Status and Future Challenge of Embedded High-speed MRAM

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2011
2011
2013
2013

Publication Types

Select...
3

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
(3 citation statements)
references
References 5 publications
0
2
0
Order By: Relevance
“…Requirements for tightly controlled DW propagation pathways, the ability to use current to drive wall motion and the need to integrate storage and spintronic devices [73,74] into miniaturised electronic circuits means that wall motion must be understood not only in continuous films (the focus of this article up until this point), but also in nanostrip geometries wherein the wall moves back and forward along a patterned ferromagnetic strip.…”
Section: Field-driven Motion In Confined Geometriesmentioning
confidence: 99%
“…Requirements for tightly controlled DW propagation pathways, the ability to use current to drive wall motion and the need to integrate storage and spintronic devices [73,74] into miniaturised electronic circuits means that wall motion must be understood not only in continuous films (the focus of this article up until this point), but also in nanostrip geometries wherein the wall moves back and forward along a patterned ferromagnetic strip.…”
Section: Field-driven Motion In Confined Geometriesmentioning
confidence: 99%
“…pin-transfer torque (STT) in MgO-based magnetic tunnel junctions (MTJs) 1,2) is under development for device applications such as STT random access memories (STT-RAM), 3,4) domain-wall-motion MRAM, 5) racetrack memory 6) and spintronic memristors. 7,8) Recently, spin-torque diodes 9) have attracted much attention because their sensitivity for the detection of microwave frequency may exceed that of semiconductor diodes.…”
mentioning
confidence: 99%
“…Owing to the emergence of copper interconnects, a corrosion protection technique becomes especially essential because Cu is easily dissolved in process solutions, such as an etching solvent, the slurry of chemical mechanical planarization (CMP), and so on. Moreover, backends of line (BEOL)-based memory applications, for example, magnetic random access memory (MRAM), 1) phase-change random access memory (PRAM), 2) and resistance random access memory (RRAM or ReRAM), 3) are currently being developed and reported. Thus, it is more important to understand the corrosion mechanism since corrosion in interconnects can easily spread to other attached structures of MRAM, PRAM, or RRAM that are composed of metal or conductive materials.…”
Section: Background Of Corrosion Studymentioning
confidence: 99%