APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058)
DOI: 10.1109/apec.2000.826117
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Current handling and thermal considerations in a high current semiconductor switch package

Abstract: -This paper presents a discussion of the way in which a combination of experimental work and computer modelling has been used to develop a high current discrete semiconductor switch package.

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