Current effect on suspended graphene nanoribbon studied using in–situ transmission electron microscopy

Liu, Chunmeng; Zhang, Jiaqi; Ramaraj, Sankar Ganesh; Zhang, Xiaobin; Muruganathan, Manoharan; Mizuta, Hiroshi; Oshima, Yoshifumi

doi:10.1016/j.apsusc.2021.151563

Cited by 3 publications

(2 citation statements)

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“…3) Similarly, water‐soluble layers are used as sacrificed substrates to avoid the etching process. [ 51,52 ] 4) Additionally, several post‐treatments can help reduce PMMA residues, [ 20 ] such as thermal annealing treatment (particularly the air or O 2 annealing), [ 53 ] plasma, ultraviolet, or ozone treatment, [ 54 ] electrochemical treatment, [ 55 ] current‐induced annealing treatment, [ 56,57 ] modified Radio Corporation of America (RCA) clean method, [ 58 ] and more.…”

Section: Transfer Methodsmentioning

confidence: 99%

Toward Clean 2D Materials and Devices: Recent Progress in Transfer and Cleaning Methods

Dong,

Dai,

Liu

et al. 2023

Advanced Materials

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Two‐dimensional (2D) materials have tremendous potential to revolutionize the field of electronics and photonics. Unlocking such potential, however, is hampered by the presence of contaminants that usually impede the performance of 2D materials in devices. This perspective provides an overview of recent efforts to develop clean 2D materials and devices. It begins by discussing conventional and recently developed wet and dry transfer techniques and their effectiveness in maintaining material “cleanliness”. Multi‐scale methodologies for assessing the cleanliness of 2D material surfaces and interfaces are then reviewed. Finally, recent advances in passive and active cleaning strategies are presented, including the unique self‐cleaning mechanism, thermal annealing, and mechanical treatment that rely on self‐cleaning in essence. The crucial role of interface wetting in these methods is emphasized, and it is hoped that this understanding can inspire further extension and innovation of efficient transfer and cleaning of 2D materials for practical applications.

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Section: Transfer Methodsmentioning

confidence: 99%

Toward Clean 2D Materials and Devices: Recent Progress in Transfer and Cleaning Methods

Dong,

Dai,

Liu

et al. 2023

Advanced Materials

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“…138 Upon precise control of the ion energy in the 11−14 eV range, the high-density H 2 and H 2 -N 2 plasmas selectively remove the polymer residues from the monolayer graphene without noticeable damage on the graphene surface. Other physical cleaning methods such as laser-assisted cleaning, 139 electron beam cleaning, 140 currentdriven cleaning, 141 and Joule self-heating 142 were also tested to remove polymer residues after the transfer process. However, those cleaning methods involve extreme conditions, which may induce defects in 2D materials, and the applicable contaminants are only limited to carbohydrates or organic molecules.…”

Section: Post-transfer Cleaningmentioning

confidence: 99%

Clean Transfer of Two-Dimensional Materials: A Comprehensive Review

Liu,

Zhao,

2024

ACS Nano

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The growth of two-dimensional (2D) materials through chemical vapor deposition (CVD) has sparked a growing interest among both the industrial and academic communities. The interest stems from several key advantages associated with CVD, including high yield, high quality, and high tunability. In order to harness the application potentials of 2D materials, it is often necessary to transfer them from their growth substrates to their desired target substrates. However, conventional transfer methods introduce contamination that can adversely affect the quality and properties of the transferred 2D materials, thus limiting their overall application performance. This review presents a comprehensive summary of the current clean transfer methods for 2D materials with a specific focus on the understanding of interaction between supporting layers and 2D materials. The review encompasses various aspects, including clean transfer methods, post-transfer cleaning techniques, and cleanliness assessment. Furthermore, it analyzes and compares the advances and limitations of these clean transfer techniques. Finally, the review highlights the primary challenges associated with current clean transfer methods and provides an outlook on future prospects.

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