Curing of resole‐type phenol–formaldehyde resin

Katović, Zvonimir

doi:10.1002/app.1967.070110106

Cited by 64 publications

(23 citation statements)

References 8 publications

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“…For CPF and LPF resins many conflicting results are presented in the literature. Some workers have reported only exothermic peaks in the ranges 60-75 • C and 135-180 • C in the curing of base-catalyzed PF resins [37,38]. Nakamura has observed exothermic peaks at 60 • C, 125 • C and 180 • C for both acid-and base-catalyzed resin [39].…”

Section: Dsc Analysis Dsc Thermograms Of Cpf and 50% Cbsl Containingmentioning

confidence: 98%

Development and characterization of a lignin–phenol–formaldehyde wood adhesive using coffee bean shell

Khan¹,

Ashraf²

2005

Journal of Adhesion Science and Technology

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In the present study, the possibility of development of a wood adhesive using coffee bean shell lignin (Cbsl) has been explored. Cbsl-modified phenolic adhesive has been prepared by replacing phenol with lignin at different weight percents. The optimization of weight percent lignin incorporation was carried out with respect to mechanical properties. It was found that up to 50 wt% of phenol could be replaced by Cbsl to give lignin-phenol-formaldehyde adhesive (LPF) with improved bond strength in comparison to control phenol-formaldehyde (CPF). Optimized LPF and CPF adhesives were characterized by IR, DSC and TGA. The IR spectrum of LPF showed structural similarity to CPF. Thermal stability of LPF adhesive was found to be lower as compared to that of CPF. DSC studies revealed a higher rate of curing in the LPF adhesive.

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Section: Dsc Analysis Dsc Thermograms Of Cpf and 50% Cbsl Containingmentioning

confidence: 98%

Development and characterization of a lignin–phenol–formaldehyde wood adhesive using coffee bean shell

Khan¹,

Ashraf²

2005

Journal of Adhesion Science and Technology

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“…Nakamura (1961) found the presence of endothermic peaks at 60°, 125° and 185° C for the base-catalyzed resin and endothermic peaks at 70°, 125° and i8o°C for the two-step acid-catalyzed resin. Using a similar DTA technique, Katovic (1967) reported two exothermic peaks at 148° and 156° C in the thermogram of a neutral sample of base-catalyzed resin. Burns and Or r ell (1967) examined the curing of PF resin in the presence of hexamine and found several different thermograms.…”

Section: Introductionmentioning

confidence: 95%

“…For example, White and Rust (1965) mixed the dry, ground resin with potassium bromide and then pelletized the mixture onto the thermocouple. Burns and Orrell (1967) diluted samples with glass beads while Katovic (1967) used dry samples directly for analysis.…”

Section: Introductionmentioning

confidence: 99%

Thermal Analysis of Liquid Phenol-Formaldehyde Resin Curing

Chow¹

1972

Holzforschung

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“…Nakamura [8] found the presence of endothermic peaks at 70, 125 and 180 ~ for the two-step acid-catalyzed resin. Using a similar DTA technique Katovic [9] reported two exothermic peaks at 148 and 156 ~ in the ~thermal curve of a base-catalyzed resin. Burns and Orrell [10] examined the curing of PF resins in the presence of hexamine and found several different thermal curves.…”

Section: Curing Reactionsmentioning

confidence: 96%

Thermal analysis of thermosetting resins

Erä

Mattila

1976

Journal of Thermal Analysis

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Applications of thermoanalytical methods for the study of resinification, curing and thermal degradation of phenolic and epoxy resins are reviewed. The curing properties of PF resins and various epoxy systems~ determined by thermal methods~ are illustrated.Phenolic and epoxy resins are the most common thermosets utilized by the plastics-processing industry. In the cured state they are infusible, insoluble, covalently-cross-linked, thermally stable network polymer structures. The formation of this network structure is responsible for the desirable physical properties which are typical of thermosetting resins over a broad temperature range.Owing to their intractable nature, the thermosetting resins are difficult to study by chemical means. Numerous investigations have shown that thermoanalytical techniques offer valuable tools for the study of the formation, the curing characteristics and the thermal degradation of these resins.The purpose of this paper is to survey the thermoanalytical methods such as differential thermal analysis (DTA), differential scanning calorimetry (DSC), thermogravimetry (TG) and thermomechanical methods, which have been successfully applied to the elucidation of the thermal characteristics of phenolic and epoxy resins. Phenol-formaldehyde resinsWhen phenol reacts with formaldehyde four major reactions occur: a) addition to give methylol phenols; b) condensation of a methylol phenol and a phenol to give a methylene bridge; c) condensation of two methylol groups to give an ether bridge; d) decomposition of ether bridges to methylene bridges and formaldehyde.The reaction is catalyzed by acids or by bases to give novolacs or resols respectively. The nature of the product is dependent on the type of catalyst and the molar ratio of the reactants. Addition and condensation are exothermic reactions, and therefore thermoanalytical methods are particularly suited for elucidation

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Curing of resole‐type phenol–formaldehyde resin

Cited by 64 publications

References 8 publications

Development and characterization of a lignin–phenol–formaldehyde wood adhesive using coffee bean shell

Development and characterization of a lignin–phenol–formaldehyde wood adhesive using coffee bean shell

Thermal Analysis of Liquid Phenol-Formaldehyde Resin Curing

Thermal analysis of thermosetting resins

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