Curing kinetics study of epoxy resin/flexible amine toughness systems by dynamic and isothermal DSC

Cai, Hongyang; Li, Peng; Sui, Gang; Yu, Yunhua; Li, Gang; Yang, Xiaoping; Ryu, Seung‐Kon

doi:10.1016/j.tca.2008.04.012

Cited by 157 publications

(92 citation statements)

References 28 publications

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“…The appropriate tool to study the problem is the thermal analysis, in particular the conventional or temperaturemodulated differential scanning calorimetry (DSC). The DSC study can be carried out in a dynamic [9,[31][32][33][34][35][36][37][38] or isothermal mode [22,[39][40][41].…”

Section: Introductionmentioning

confidence: 99%

A quantitative approach to dynamic and isothermal curing of an epoxy resin modified with oligomeric siloxanes

Murias

Byczyński

Maciejewski

et al. 2015

J Therm Anal Calorim

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The reactivity of a system comprising commercial epoxy resin Epidian Ò 6 (E6) and triethylenetetramine (Z-1) hardener was studied. The system was modified with two low-molecular siloxane modifiers: 1,3-bis(glycidyloxypropyl)-1,1,3,3-tetramethyldisiloxane (DS1) and 1,3-bis(aminopropyl)-1,1,3,3-tetramethyldisiloxane (DS2). The modifiers replaced 10 mass% of E6 or Z-1, respectively. The systems E6/DS2 and DS1/Z-1 were also studied. Enthalpy of curing was determined for all systems in isothermal conditions and dynamically, i.e., in the range of 0-250°C with linearly increasing temperature at the rate of 2, 5, 10, and 20°C min -1 . The activation energy of curing was determined using isoconversional methods by Friedman and Kissinger-Akahira-Sunose. The epoxy systems containing siloxane modifiers had generally lower activation energies than the reference E6/Z-1 system. The time to gelation measurements were taken using the temperaturemodulated differential scanning calorimetry.

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Section: Introductionmentioning

confidence: 99%

A quantitative approach to dynamic and isothermal curing of an epoxy resin modified with oligomeric siloxanes

Murias

Byczyński

Maciejewski

et al. 2015

J Therm Anal Calorim

View full text Add to dashboard Cite

show abstract

“…Kinetic model for these reactions can either be th order or autocatalytic. However, studies have shown that most epoxy resin cure reactions are autocatalytic in nature [16,17,27,29]. During curing, low viscosity SC-15 epoxy resin system undergoes physical changes such as gelation and vitrification before complete solidification [15,24,27].…”

Section: Isothermal Rheological Studiesmentioning

confidence: 99%

“…For nanoclay based systems, there was an enhanced reaction when compared to neat samples at the same temperature. Temperature has also been shown to influence viscosity, vitrification, and degree of intergallery expansion of clay platelets, thereby affecting chemical reaction during curing [16][17][18].…”

Section: Isothermal Rheological Studiesmentioning

confidence: 99%

“…Interactions between nanoclay particles and epoxy molecules affect the viscosity and mobility of reacting species during curing. Consequently this influences rate of cure, reaction time, enthalpy, vitrification, activation energy, viscoelastic properties, and crosslinking density of the final composite [9,12,16,17]. Other factors such as type and amount of clay fillers and organic modifiers and their interaction with the intended host polymer molecules and their curing agents have all shown to influence properties of polymeric composites during processing [12-14, 17, 18].…”

Section: Introductionmentioning

confidence: 99%

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Effects of Surface Treatments of Montmorillonite Nanoclay on Cure Behavior of Diglycidyl Ether of Bisphenol A Epoxy Resin

Tcherbi-Narteh

Hosur

Triggs

et al. 2013

Journal of Nanoscience

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Diglycidyl ether of Bisphenol A (DGEBA) based SC-15 epoxy resin was modified with three different commercially available montmorillonite (MMT) nanoclay: Nanomer I.28E and Cloisite 10A and 30B. Cure behavior of nanocomposites was studied using a variety of techniques. Primary focus of this study was to investigate influence of different surface modifications of MMT nanoclay on rheological properties and cure behavior of SC-15 epoxy resin. By adding MMT to SC-15 epoxy resin, chemistry of the epoxy is altered leading to changes in rheological properties and ultimately enthalpy and activation energy of reactions. Addition of Nanomer I.28E delayed gelation, while Cloisite 10A and 30B accelerated gelation, regardless of the curing temperature. Activation energy of reaction was lower with the addition of Nanomer I.28E and Cloisite 10A and higher for Cloisite 30B compared to neat SC-15 epoxy composite.

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“…Differential Thermometry Analysis (TG/DTA) 40 Results from TG/DTA analysis for the curing of DGEBA by use of catalysts 2-7 at four concentrations were summarized in Table I, in which showed the exotherm onset, exotherm peak, and total heat for the polymerization. We found that the curing of DGEBA by the catalysts 2-7 showed one main exotherm peak varying with different catalyst concentration in TG/DTA and the peaks shifted towards lower temperatures when catalysts 2-7 increased (molding study see the Figure 2).…”

mentioning

confidence: 99%

Amphiphatic Piperazine, Pyrazine, and Pyridine Derivaties as the Thermal Latency for Epoxy-Phenolic Resins

et al. 2009

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Curing kinetics study of epoxy resin/flexible amine toughness systems by dynamic and isothermal DSC

Cited by 157 publications

References 28 publications

A quantitative approach to dynamic and isothermal curing of an epoxy resin modified with oligomeric siloxanes

A quantitative approach to dynamic and isothermal curing of an epoxy resin modified with oligomeric siloxanes

Effects of Surface Treatments of Montmorillonite Nanoclay on Cure Behavior of Diglycidyl Ether of Bisphenol A Epoxy Resin

Amphiphatic Piperazine, Pyrazine, and Pyridine Derivaties as the Thermal Latency for Epoxy-Phenolic Resins

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