2007
DOI: 10.1007/s10973-006-7747-3
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Curing kinetics of amine and sodium hydroxide catalyzed phenol-formaldehyde resins

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Cited by 50 publications
(42 citation statements)
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“…From data obtained applying three different isoconversional methods, it is shown that the Ozawa-Flynn-Wall (OFW) and Friedman (FR) models describe similar evolution of the activation energy with the curing degree (Figures 3-5). By increasing the apparent curing degree to more than 70%, the activation energy showed dependence on α values [30], which is also noticed for the curing process of other thermoset resins [11,30,31] and ascribed to the slower diffusion. The activation energy values are insignificantly influenced by apparent curing degree α, especially in the range from 20 to 70% (Figures 3-5).…”
Section: Resultssupporting
confidence: 57%
“…From data obtained applying three different isoconversional methods, it is shown that the Ozawa-Flynn-Wall (OFW) and Friedman (FR) models describe similar evolution of the activation energy with the curing degree (Figures 3-5). By increasing the apparent curing degree to more than 70%, the activation energy showed dependence on α values [30], which is also noticed for the curing process of other thermoset resins [11,30,31] and ascribed to the slower diffusion. The activation energy values are insignificantly influenced by apparent curing degree α, especially in the range from 20 to 70% (Figures 3-5).…”
Section: Resultssupporting
confidence: 57%
“…The DSC curve provides important exothermic reaction information on the resin curing process such as temperature range, heat generation (denoting reaction activity), etc. . Previous studies have indicated that there are generally two exothermic peak values in the DSC curve of the phenolic resin; the first corresponds to methylene bond formation by the reaction between hydroxymethyl functional groups and the phenolic hydroxyl group and to the production of the dibenzyl ether bond from two hydroxymethyl groups, whereas the second peak corresponds to the production of the methylene bond by the dibenzyl ether bond through formaldehyde condensation .…”
Section: Resultsmentioning
confidence: 95%
“…However, the lower curing rate and required higher curing temperature compared to other thermosetting adhesives limit the application of PF resins for use in impregnating resins or adhesives [2,3]. Many attempts have been made to accelerate the curing rate or lower the curing temperature, including testing of various catalysts or additives to alter the reaction kinetics, such as carboxylic acid esters [4,5], anhydrides [6], amides [7], carbonate [8], and metallic ions [9]. Additionally, the effects of the condensation condition on the PF resin structure and properties have been well studied by conventional analytical techniques.…”
Section: Introductionmentioning
confidence: 99%