2019
DOI: 10.1007/s10904-019-01290-1
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Curing Kinetics and the Properties of KH560-SiO2/Polyethersulfone/Bismaleimide-Phenolic Epoxy Resin Composite

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Cited by 26 publications
(8 citation statements)
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“…It could increase the interfacial polarization of the composite 39,40 . In addition, decreasing of the bonding between matrix and SiO 2 particles could contribute to motion of molecular chains and thus to increase the steering polarization and orientational polarization to some extend 41 . The factors could lead to the increase of dielectric constant of composites with high amount of SiO 2 particles.…”
Section: Resultsmentioning
confidence: 99%
“…It could increase the interfacial polarization of the composite 39,40 . In addition, decreasing of the bonding between matrix and SiO 2 particles could contribute to motion of molecular chains and thus to increase the steering polarization and orientational polarization to some extend 41 . The factors could lead to the increase of dielectric constant of composites with high amount of SiO 2 particles.…”
Section: Resultsmentioning
confidence: 99%
“…The degree of crosslinking, curing process and mechanical properties, as coupling results of chemical reaction, heat transfer and product quality, play a decisive role in the comprehensive performance of the composites [9]. Some researches on the curing process and mechanical properties of the laminated composites are mainly focused on the curing kinetics and the stacking methods of the prepregs, respectively, which are not only the key to the success of curing process, but also are the guarantee of products quality [10,11].…”
Section: Introductionmentioning
confidence: 99%
“…Kumar et al 17 studied a TEIA bio-resin containing 2-methylimidazole-diglycidyl ether bisphenol A (DGEBA) epoxy resin, and used DSC to study the nonisothermal DGEBA epoxy resin and the curing kinetics of its bio-based blending system. Chen et al 18 reported a KH560-SiO 2 /polyethersulfone/bismaleimide-phenolic epoxy resin composite and studied the curing kinetics and apparent activation energy of the resin system by DSC method. Elmore et al 19 prepared an amide amine waterborne epoxy curing agent.…”
Section: Introductionmentioning
confidence: 99%