2023
DOI: 10.1016/j.eurpolymj.2023.112579
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Curing Kinetics and Structure-Property Relationship of Moisture-Cured One-Component Polyurethane Adhesives

Hojun Moon,
Jeong Eun Park,
Woongbi Cho
et al.
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Cited by 4 publications
(1 citation statement)
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“…At present, the development of electronic appliances has a great demand for thermal management materials, primarily consisting of thermosetting polymer composites such as silicone, epoxy resin, and polyurethane. 45,46 The common feature of these matrices is that they cannot be recycled after use and must be discarded, which wastes not only a lot of polymer resources, but also a large quantity of thermally conductive inorganic fillers such as aluminum oxide, boron nitride, aluminum nitride, etc. The thermally conductive polymer composites with covalent–noncovalent interpenetrating networks prepared in this work can achieve closed-loop chemical recycling.…”
Section: Resultsmentioning
confidence: 99%
“…At present, the development of electronic appliances has a great demand for thermal management materials, primarily consisting of thermosetting polymer composites such as silicone, epoxy resin, and polyurethane. 45,46 The common feature of these matrices is that they cannot be recycled after use and must be discarded, which wastes not only a lot of polymer resources, but also a large quantity of thermally conductive inorganic fillers such as aluminum oxide, boron nitride, aluminum nitride, etc. The thermally conductive polymer composites with covalent–noncovalent interpenetrating networks prepared in this work can achieve closed-loop chemical recycling.…”
Section: Resultsmentioning
confidence: 99%