Curing behavior of epoxy/POSS/DDS hybrid systems

Abstract

The curing behavior of a difunctional epoxy resin/octa(aminopropyl)silsesquioxanes hybrid resin system using 4,4′′‐diaminodiphenyl sulfone as curing agent was studied. Fourier transform infrared (FTIR) spectroscopy was used to evidence the formation of the hybrid resin and to monitor the curing process. Results showed that the reactivity of the hybrid resin system was slightly lower than that of the pristine epoxy resin. Differential scanning calorimetry was used to study the curing kinetics of the hybrid resin. The curing kinetics of the pristine and hybrid resins was analyzed by two methods: Kissinger and Flynn‐Wall‐Ozawa methods. The FTIR analysis accorded well with the results of the kinetics study. POLYM. COMPOS., 29:77–83, 2008. © 2007 Society of Plastics Engineers

Properties and curing kinetics of C21-based reactive polyamides as epoxy-curing agents derived from tung oil

“…Curing kinetic parameters are generally determined by analyzing the experimental results obtained by different thermal analysis techniques. [5][6][7][8][9] Differential scanning calorimetry (DSC), both in the scanning and non-isothermal modes, has been used extensively in this manner. [10][11][12][13][14] This paper reports the mechanical properties of C 21 diacid-based polyamides from tung oil curing DGEBA and curing kinetics based on non-isothermal DSC measurements, applying the simple and consistent method of Málek [15][16][17][18][19][20] to the kinetic analysis of data obtained by thermal treatment.…”

Syntheses of silsesquioxane (POSS)-based inorganic/organic hybrid and the application in reinforcement for an epoxy resin

“…In order to deal with the kinetic behavior, Kissinger and FlynnWall-Ozawa proposed some models [21,22,6]. Kissinger's method was based on the following equation:…”

“…It is reported that some thermal and mechanical properties of epoxy resins could be improved after incorporation of functional POSS into epoxy resins. Zhang et al added octa (aminopropyl) silsesquioxanes (POSS-NH 2 ) to epoxy resins and studied the curing behavior [6], viscoelastic, mechanical properties, micromorphologies [7], and thermo-oxygen resistance of the epoxy network [8]. A plenty of reports on preparations and applications for enhancing epoxy resins by addition of inorganic/organic hybrid containing POSS have been found [9][10][11][12][13][14][15][16].…”

Effect of graphene oxide sheet size on the curing kinetics and thermal stability of epoxy resins

“…Zhang et al [12] found that the incorporation of 54 POSS-NH 2 decreased the reaction rate of epoxy resins at early stages, while this effect was 55 not obvious at the late stages of the curing reaction. The average activation energy of the 3 curing reaction of the epoxy nanocomposites was higher than the pristine system.…”