Curie-supported accelerated curing by means of inductive heating – Part I: Model building

Voß, Morten; Kaufmann, Marvin; Vallée, Till

doi:10.1080/00218464.2021.1902810

Cited by 5 publications

(9 citation statements)

References 93 publications

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“…A typical curve of temperature and the predicted curing degree as a function of curing time during AMF treatment is plotted in Figure 6. It can be observed that the temperature of adhesive experienced a rapid increase initially due to the heat generated from MNPs and that released by curing reaction 29 . During the reaction procedure, the heat released by reaction decreases as the curing degree increases to higher level.…”

Section: Resultsmentioning

confidence: 99%

“…It can be observed that the temperature of adhesive experienced a rapid increase initially due to the heat generated from MNPs and that released by curing reaction. 29 During the reaction procedure, the heat released by reaction decreases as the curing degree increases to higher level. As shown in Figure 6, the slope of temperature curve at the start of the curing period is close to 5 C/min.…”

Section: Curing Kinetics Of the Epoxy Adhesivementioning

confidence: 99%

“…But the mechanical variation during curing process could influence the formation of thick and complex bulk and joint. 1,29 Therefore, the variation of mechanical properties during magnetocuring process requires investigation. Besides, both the heat efficiency and mechanical properties are related to the amount of doped MNPs.…”

Section: Introductionmentioning

confidence: 99%

“…As for magnetocuring, most papers considered curing degree as an evaluation metric of a completed curing. But the mechanical variation during curing process could influence the formation of thick and complex bulk and joint 1,29 . Therefore, the variation of mechanical properties during magnetocuring process requires investigation.…”

Section: Introductionmentioning

confidence: 99%

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Curing kinetics and mechanical properties of magnetocured epoxy adhesive doped with magnetic nanoparticles

Zhang,

Wu,

Zhang

et al. 2023

Polymer Composites

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The curing kinetics as well as the corresponding tensile properties of magnetocured epoxy adhesive doped with magnetic nanoparticles (MNPs) is investigated in this article, where the curing reaction process is depicted using an isoconversional model. It is found that the tensile modulus and strength strongly depend on the curing degree (CD) and mass fraction of MNPs when curing degree varies from 0.7 to 1.0. When curing degree is 0.7, the tensile modulus of the adhesive with 15%wt and 30%wt MNPs increases by 46% and 592% compared to that with 10%wt MNPs, respectively, but the increase is not obvious when curing degree is higher than 0.9. This difference is more significant in the tested tensile strength, where the samples with 15%wt and 30%wt MNPs are 7.08 and 20.83 times higher than the one with 10%wt MNPs under 0.7 curing degree. However, the corresponding tensile strength with 1.0 curing degree is reduced by 4% and 35%, respectively. Scanning electron microscopy observation reveals different fracture mechanisms caused by curing degree variation. Failure occurs in the adhesive region for curing degree below 0.9, while failure initiates and propagates at the interface between adhesive and MNPs for curing degree above 0.9. It can be concluded that the intrinsic property of the adhesive determines the tensile properties when the curing degree is lower than 0.9, while the weak interfacial interaction between adhesive and MNPs introduces reverse effect when the curing degree is higher than 0.9. This competitive relationship should be considered in the design of magnetocuring process.Highlights Enhancement in adhesive modulus from MNPs addition degrades as CD approaches 1. Intrinsic property of adhesive determines the tensile strength with CD < 0.9. Weak interface dominates the failure mechanism in adhesive with CD > 0.9.

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Section: Resultsmentioning

confidence: 99%

Section: Curing Kinetics Of the Epoxy Adhesivementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Curing kinetics and mechanical properties of magnetocured epoxy adhesive doped with magnetic nanoparticles

Zhang,

Wu,

Zhang

et al. 2023

Polymer Composites

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“…Very recently, the same research group assessed the feasibility of IH for: (i) the lowtemperature curing of three different two-component structural adhesives (one polyurethane and two epoxy adhesives), into which Curie particles were incorporated at 33.3 wt.% constant loading [49], and for (ii) the fast curing of two two-component epoxy adhesives, using the same Curie particle loading [50,51]. Concerning the former, the heating behavior of glued-in-rod joints conditioned at −10 • C and −30 • C was compared to that of the same joints that were IH-cured starting from ambient temperature (i.e., 23 • C).…”

Section: Curing Of Thermosetting Systemsmentioning

confidence: 99%

Insights into Induction Heating Processes for Polymeric Materials: An Overview of the Mechanisms and Current Applications

Mariani

Malucelli

2023

Energies

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In polymer systems, induction heating (IH) is the physical outcome that results from the exposure of selected polymer composites embedding electrically-conductive and/or ferromagnetic fillers to an alternating electromagnetic field (frequency range: from kHz to MHz). The interaction of the applied electromagnetic field with the material accounts for the creation of magnetic polarization effects (i.e., magnetic hysteresis losses) and/or eddy currents (i.e., Joule losses, upon the formation of closed electrical loops), which, in turn, cause the heating up of the material itself. The heat involved can be exploited for different uses, ranging from the curing of thermosetting systems, the welding of thermoplastics, and the processing of temperature-sensitive materials (through selective IH) up to the activation of special effects in polymer systems (such as self-healing and shape-memory effects). This review aims at summarizing the current state-of-the-art of IH processes for polymers, providing readers with the current limitations and challenges, and further discussing some possible developments for the following years.

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Low-temperature curing of adhesives – Large-scale experiments

Voß

Evers

Vallée

2022

The Journal of Adhesion

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Curie-supported accelerated curing by means of inductive heating – Part I: Model building

Cited by 5 publications

References 93 publications

Curing kinetics and mechanical properties of magnetocured epoxy adhesive doped with magnetic nanoparticles

Curing kinetics and mechanical properties of magnetocured epoxy adhesive doped with magnetic nanoparticles

Insights into Induction Heating Processes for Polymeric Materials: An Overview of the Mechanisms and Current Applications

Low-temperature curing of adhesives – Large-scale experiments

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