Cure profiles, crosslink density, residual stresses, and adhesion in a model epoxy

Case, Sandra L.; O'Brien, Emmett P.; Ward, T. C.

doi:10.1016/j.polymer.2005.09.053

Cited by 44 publications

(28 citation statements)

References 24 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Consequently, more fluctuations in the molecular structure were generated, and the rate of expansion increased upon heating. However, as previously reported [12][13][14], increasing the filler content decreases the free volume content. Hence, the The left micrographs (a, c, e, g) are taken at 9500 magnification, and the right micrographs (b, d, f, h) are taken at 92,000 magnification space for expansion of the polymer decreases, and the CTEs of the composites are further decreased.…”

Section: Coefficient Of Thermal Expansion (Cte)supporting

confidence: 73%

Fabrication and characterization of nano filler-filled epoxy composites for underfill application

Firdaus

Mariatti

2011

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

The present research aims to fabricate and characterize different nano filler types and filler loadings in epoxy composites for underfill application. The nano filler types were synthetic diamond (SD), boron nitride (BN), and silica (S). The filler loadings which were considered in the study were varied from 1 to 4 vol%. Sonication process was used to facilitate filler dispersion. The results showed that BN had a good flow ability, with higher flow rates than the other filler types. The thermal conductivity of the composites increased with the addition of fillers, and higher thermal conductivity value is observed in SD system. The coefficient of thermal expansion (CTE) of composites decreased with the addition of filler with lower CTE value shown by BN system. Generally, SD showed higher flexural strength and flexural modulus compared with BN and S. A high filler loading also resulted in decreased flexural strength but increased flexural modulus.

show abstract

Section: Coefficient Of Thermal Expansion (Cte)supporting

confidence: 73%

Fabrication and characterization of nano filler-filled epoxy composites for underfill application

Firdaus

Mariatti

2011

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

show abstract

“…This can be attributed largely to the interaction between water and the system's adsorption sites (i.e. hydroxyl group, amino group, polymer chain end), which fills the gaps between polymer chains [21]. The polymerization of AH Plus occurs through the action of its polyamine monomers (1-adamantane amine, N,N'-dibenzyl-5-oxanonandiamine-1,9, TCD-Diamine).…”

Section: Discussionmentioning

confidence: 99%

Solubility and apical sealing characteristics of a new calcium silicate-based root canal sealer in comparison to calcium hydroxide-, methacrylate resin- and epoxy resin-based sealers

Erşahan¹,

Aydın²

2012

Acta Odontologica Scandinavica

View full text Add to dashboard Cite

show abstract

“…These results are consistent with typical water absorption levels of cured epoxy adhesives. 43,44 Hydrolytic Stability of Different Off-Stoichiometry Thiolene-epoxy Thermosets Compared with Stoichiometric Thiol-ene As shown in Figures 12 and 13 the mechanical properties of the thiol-ene-epoxy networks are less affected by ester hydrolysis than the stoichiometric thiol-ene network. After 4 days in water at 85 C the stoichiometric thiol-ene network shows a 86% reduction in storage modulus at 25 C [ Fig.…”

Section: Stability and Curing Behavior During The First Curingmentioning

confidence: 98%

Functional off-stoichiometry thiol-ene-epoxy thermosets featuring temporally controlled curing stages via an UV/UV dual cure process

Carlborg

Vastesson

Liu

et al. 2014

J. Polym. Sci. Part A: Polym. Chem.

View full text Add to dashboard Cite

We present a facile two-stage UV/UV activation method for the polymerization of off-stoichiometry thiol-eneepoxy, OSTE1, networks. We show that the handling and processing of these epoxy-based resins is made easier by introducing a material with a controlled curing technique based on two steps, where the first step offers excellent processing capabilities, and the second step yields a polymer with suitable endproperties. We investigate the sequential thiol-ene and thiolepoxy reactions during these steps by studying the mechanical properties, functional group conversion, water absorption, hydrolytic stability, and thermal stability in several different thiol-ene-epoxy formulations. Finally, we conclude that the curing stages can be separated for up to 24 h, which is promising for the usefulness of this technique in industrial applications. INTRODUCTIONThe huge impact of thermoset polymers in applications ranging from biological implants to airplane building materials stems from the ability to precisely control their curing behavior while simultaneously allowing for tuned final properties. Epoxy resins belong to a particular versatile family of polymers that are widely used in industrial applications exhibiting good mechanical end-use properties, excellent bonding to a variety of substrates, and good chemical resistance. Considerable effort has been devoted to develop a plethora of different epoxies with end-properties optimized for many different applications.

show abstract

Cure profiles, crosslink density, residual stresses, and adhesion in a model epoxy

Cited by 44 publications

References 24 publications

Fabrication and characterization of nano filler-filled epoxy composites for underfill application

Fabrication and characterization of nano filler-filled epoxy composites for underfill application

Solubility and apical sealing characteristics of a new calcium silicate-based root canal sealer in comparison to calcium hydroxide-, methacrylate resin- and epoxy resin-based sealers

Functional off-stoichiometry thiol-ene-epoxy thermosets featuring temporally controlled curing stages via an UV/UV dual cure process

Contact Info

Product

Resources

About