Cure kinetics of dicyanate matrix polymers

Abstract

The cure kinetics of two dicyanate resins were investigated by differential scanning calorimetry under isothermal and nonisothermal conditions. An autocatalytic kinetic model was proposed and a set of general kinetic parameters was calculated from the isothermal experiments. Good agreement between experimental data and the kinetic model has been obtained under different processing conditions, which demonstrated the validity and the usefulness of the analytical procedure and of the kinetic expression employed. Consequently, in its current form, the modeling methodology is capable of describing the degree of cure during a typical processing cycle and has the potential for comparing different resin formulations as well as the manifestations of cure in property development. Specifically, in this work the modeling methodology was tested using two distinct dicyanate resin systems while the development of the cure was also observed through dielectric analysis (DEA).

Activation energy determinations from dielectric thermal analysis of reacting polymeric systems

“…For the TGDDM/DDS system (Table 3) (Table 4), the same trends were observed with activation energies calculated from DEA lower than those calculated from DSC in isothermal and higher than those from DSC in nonisothermal experiments. Compared with a value of 19 kcal/mole obtained from DSC kinetic studies on this system [10], the activation energies calculated from the proposed dielectric method are in excellent agreement with values obtained by established methodologies.…”

Chemorheological studies on a dicyanate resin modified with polyethersulfone

“…To improve the mechanical properties of dicyanate resins, high‐performance thermoplastics such as polysulfones and polyimides have been added to the resins. Recent studies have focused on their potential matrix applications in advanced composites and electronics 2–8…”

Curing and mechanical properties of dicyanate/poly(ether sulfone) semi‐interpenetrating polymer networks

“…The dicyanate resins combine the processing advantages and handling convenience of epoxy resins, the fire resistance of phenolic resins, and the high‐temperature performance of polysulfones or polyimides. Recent studies have focused on their potential matrix applications in advanced composites and electronics 2–6…”