Cure kinetics of biphenyl epoxy‐phenol novolac resin system using triphenylphosphine as catalyst

Han, Seung Seog; Yoon, Ho Gyu; Suh, Kwang S.; Kim, Whan Gun; Moon, Taehwan

doi:10.1002/(sici)1099-0518(19990315)37:6<713::aid-pola6>3.3.co;2-9

Cited by 20 publications

(28 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…For DGEBA treated with carboxylic acid 4 and amphiphatic compound 5-9, however, Scheme II. Proposed mechanism of adduct formation for the cure diglycidylether of bisphenol A, (DGEBA, NPEK-114M) with the organic Lewis acid-base hybrid catalysts (4)(5)(6)(7)(8)(9). the viscosity of DGEBA retained almost constant at ~2,000 cp.…”

Section: Resultsmentioning

confidence: 99%

“…Commercial available starting materials were used as purchased. Diglycidylether of bisphenol A (DGEBA, NPEK-114M) was purchased form Nan Ya Plastics Co. 3-(2-Ethyl-4-methyl-imidazol-1-yl)-propionitrile (2E4MZ-CN, 2) and 2-ethyl-4-methylimidazole (2E4MZ, 1) were purchased form Shikoku Chemical Co. Histamine (3), 3-phenylpropanoic acid (4), and imidazole-4-acrylic acid (6) were purchased from Acoros Chemical Co. 2-Amino-3-phenylpropanoic acid (5) and 2-amino-3-(imidazole-4-yl)-propionic acid (8) were purchased from Novabiochem Co. 3-(Imidazole-4-yl)-propionic acid (7) and N-tert-butoxycarbonylhistidine (9) were prepared by reported procedure. 21,22 Synthesis of 3-(imidazol-4-yl)propionic Acid (7).…”

Section: Methodsmentioning

confidence: 99%

“…[1][2][3][4][5][6][7] As an epoxy resin, high molecular weight biphenyl type epoxy resins are highly reliable electronic molding compounds (EMC) with good adhesion and high toughness, and can be used as high filter loadings. [8][9][10] Nevertheless, the biphenyl type epoxy resins of low molecular weight show low storage stability at room temperature. To improve the pot life at room temperature, latent catalysts are thus developed.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Improvement of the thermal latency for epoxy-phenolic resins by novel amphiphatic imidazole catalysts

Wong¹,

Lin

Chen

et al. 2010

Macromol. Res.

View full text Add to dashboard Cite

Novel amphiphatic imidazole compounds were evaluated as thermal latent catalysts for the polymerization of diglycidyl ether of bisphenol A (DGEBA). Amphiphatic compounds 5-9, two commercially available catalysts 1 and 2, and compounds 3 and 4 were used to cure epoxy resin systems for an investigation of their thermal latency and storage stability. The results from the cure activation energy and viscosity-storage time of the catalysts, the order of thermally latent activity was 3-phenylpropanoic acid (4) > 2-amino-3-phenylpropinoic acid (5) > 2-amino-3-(imidazole-4-yl)-propionic acid (H-His-OH, 8) > N-tert-butoxycarbonyl-histidine (9) > imidazole-4-acrylic acid (6) > 3-(imidazole-4-yl)propionic acid (7) > 1-cyanoethyl-2-ethyl-4-methyl-imidazole (2) > 2-ethyl-4-methylimidazole (1) > histamine (3). From the results, the amphiphatic imidazole catalysts 5-9 showed better thermal latency than commercialized catalysts 1 and 2, basic catalyst 3 and acidic catalyst 4. Concerning the glass transition temperature (T g ), the use of amphiphatic imidazole catalysts 5-9 provided complete or near complete curing systems at temperatures ranging from 152-163 o C, which were similar to two commercially available catalysts (151-152 o C, 1 and 2) and histamine (159 o C, 3). On the other hand, the T g for compounds 4 and 5 could not be detected at 30-300 o C from the temperature scans because of their weak nucleophilicity and low cross-linking reactivity.

show abstract

Section: Resultsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Improvement of the thermal latency for epoxy-phenolic resins by novel amphiphatic imidazole catalysts

Wong¹,

Lin

Chen

et al. 2010

Macromol. Res.

View full text Add to dashboard Cite

show abstract

“…They can be transformed into the infinite molecular weight thermosetting polymers with threedimensional cross-linked network solidified by hardener curing processes to provide the excellent mechanical and chemical properties: heat, moisture and chemical resistance, toughness, electrical and mechanical resistance, etc. [9]. Nevertheless, the biphenyl type epoxy resins of low molecular weight show low storage stability at room temperature.…”

Section: Introductionmentioning

confidence: 99%

Investigation of soluble PEG-imidazoles as the thermal latency catalysts for epoxy-phenolic resins

Yen¹,

Chen²,

Yeh³

et al. 2016

Journal of the Taiwan Institute of Chemical Engineers

View full text Add to dashboard Cite

“…The equation for diffusion control factor (f d ) in the present-day form is follows [45][46][47][48][49][50][51]:…”

Section: Modeling Of Isothermal Curing Processmentioning

confidence: 99%

The kinetic analysis of isothermal curing reaction of an unsaturated polyester resin: Estimation of the density distribution function of the apparent activation energy

Janković

2010

Chemical Engineering Journal

View full text Add to dashboard Cite

Cure kinetics of biphenyl epoxy‐phenol novolac resin system using triphenylphosphine as catalyst

Cited by 20 publications

References 0 publications

Improvement of the thermal latency for epoxy-phenolic resins by novel amphiphatic imidazole catalysts

Improvement of the thermal latency for epoxy-phenolic resins by novel amphiphatic imidazole catalysts

Investigation of soluble PEG-imidazoles as the thermal latency catalysts for epoxy-phenolic resins

The kinetic analysis of isothermal curing reaction of an unsaturated polyester resin: Estimation of the density distribution function of the apparent activation energy

Contact Info

Product

Resources

About