Cure Kinetics of an Epoxy-Anhydride-Imidazole Resin System by Isothermal DSC

Abstract

The cure kinetics of a dimethyl imidazole catalyzed diglycidyl ether of bisphenol A - methyltetrahydrophthalic anhydride resin system was examined. Degree of conversion versus cure time was obtained using isothermal DSC over the temperature range from 80 °C to 140 °C. The kinetic data were analysed using both nth order and autocatalytic kinetic models. The results indicated that the epoxy curing process could be described satisfactorily by Kamal's four-parameter generalised autocatalytic model modified with an exponential function of conversion defined as the diffusion factor. The curing process was predominantly autocatalytic in nature. The autocatalytic rate constant of the resin system was 10 to 60 times larger than the nth order rate constant. The corresponding activation energies obtained from Arrhenius equation were 78.1 kJ/mol and 67.6 kJ/mol, respectively. The approximate order of reaction was 0.39 for the autocatalytic reactions and 1.0 for the nth order reactions.

The synergistic impacts of hybrid nanofillers of graphene nanoplatelets/carbon nanotubes on curing behavior of an epoxy‐vinyl ester interpenetrating polymer network nanocomposite coating

“…The ring-opening reaction of the epoxy resin with MTHPA in the presence of 1-Methyl Imidazole. 133 Step 3. Esterification reaction of hydroxyl groups of the vinyl ester resin with MTHPA.…”

Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators

“…Capable of controlling initial polymerization, or curing, thermally latent catalysts are used in packaging. In EMCs, typical accelerators are imidazole [2,9], amines [10][11][12], organophosphine [1,10], urea derivatives [13,14], or Lewis bases and their organic salts [15,16]. However, most accelerators tend to reduce the pot life or moldability of molding materials, owing to their ability to initiate reactions at extremely low temperatures.…”

Elucidating How Advanced Organophosphine Accelerators Affect Molding Compounds

“…Capable of controlling initial polymerization or curing, thermally latent catalysts are used in packaging. In EMCs, typical accelerators are imidazole, 7,8 amines, 9−11 organophosphine, 6,9 urea derivatives, 12,13 or Lewis bases and their organic salts. 14,15 However, most accelerators tend to reduce the pot life or moldability of molding materials, owing to their ability to initiate reactions at extremely low temperatures.…”

“…Highly reliable plastic-encapsulated semiconductor packages are thus required. Previous studies have attempted to improve the reliability of EMCs, which are advanced IC packages, by studying matrix resin modification, hardeners, coupling agent treatment, accelerator, ,− and filler processes . For specific and functional packaging in semiconductor devices, many molding compound types are available in the semiconductor industry.…”

“…Capable of controlling initial polymerization or curing, thermally latent catalysts are used in packaging. In EMCs, typical accelerators are imidazole, , amines, − organophosphine, , urea derivatives, , or Lewis bases and their organic salts. , However, most accelerators tend to reduce the pot life or moldability of molding materials, owing to their ability to initiate reactions at extremely low temperatures. Therefore, an effective hardening accelerator must have a thermal latency that promotes the rapid curing of resins when heated to a particular temperature; in contrast, latent accelerators are inert at low temperatures. , Exactly how curing accelerators affect the physical characteristics of EMC have been thoroughly studied. ,, In these works, EMCs with triphenyl phosphine (TPP) have optimal physical properties when cured, subsequently improving the reliability of the encapsulated semiconductors.…”