Cure kinetics of a low epoxide/hydroxyl group‐ratio bisphenol a epoxy resin–anhydride system by infrared absorption spectroscopy

Stevens, G.C.

doi:10.1002/app.1981.070261225

Cited by 104 publications

(35 citation statements)

References 23 publications

(2 reference statements)

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“…[21][22][23][24] Figure 1 presents the FTIR spectra of the bisANER/ MHHPA system during the curing reaction. The assignments of the absorption features are as follows: 25,26 À1 to the pathalic anhydride CÀ ÀO, the stretching of CÀ ÀOÀ ÀC on epoxide also occurs in this region but cannot be clearly discerned in the uncured resin system, 913 cm À1 to epoxide groups, 830 cm À1 to the out-of-plane deformation of the aromatic CH, 750 and 624 cm À1 to the out-ofplane deformation of the phthalic anhydride CÀ ÀH and CÀ ÀCÀ ÀC.…”

Section: Ftir Study Of Curing Reactionmentioning

confidence: 98%

Curing behavior and thermal properties of multifunctional epoxy resin with methylhexahydrophthalic anhydride

Liu

Zhang

et al. 2006

J of Applied Polymer Sci

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ABSTRACT:The curing behavior and thermal properties of bisphenol A type novolac epoxy resin (bisANER) with methylhexahydrophthalic anhydride (MHHPA) at an anhydride/epoxy group ratio of 0.85 was studied with Fouriertransform infrared (FTIR) spectroscopy, differential scanning calorimetry (DSC), and thermogravimetry. The results showed that the FTIR absorption intensity of anhydride and epoxide decreased during the curing reaction, and the absorption peak of ester appeared. The dynamic curing energies were determined as 48.5 and 54.1 kJ/mol with Kissinger and Flynn-Wall-Ozawa methods, respectively. DSC measurements showed that as higher is the curing temperature, higher is the glass transition. The thermal degradation of the cured bisANER/MHHPA network was identified as two steps: the breaking or detaching of À ÀOH, À ÀCH 2 À À, À ÀCH 3 , OCÀ ÀO and CÀ ÀOÀ ÀC, etc., taking place between 300 and 4508C; and the carbonizing or oxidating of aromatic rings occurring above 4508C. The kinetics of the degradation reaction was studied with Coats-Redfern method showing a first-order process. In addition, vinyl cyclohexene dioxide (VCD) was employed as a reactive diluent for bisANER (VCD/bisANER ¼ 1 : 2 w/w) and cured with MHHPA, and the obtained network had a higher T g and a slight lower degradation temperature than the undiluted system.

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Section: Ftir Study Of Curing Reactionmentioning

confidence: 98%

Curing behavior and thermal properties of multifunctional epoxy resin with methylhexahydrophthalic anhydride

Liu

Zhang

et al. 2006

J of Applied Polymer Sci

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“…The employed apparatus was a Nicolet 510 equipped with a Spectratech IR-plan microscope. The IR bands (Table I) were attributed using reference works, 10 -12 the results of Lin et al, 4 and especially those of Stevens, 13,14 and by comparing the spectra of the constituents with those of the 2 crosslinked systems (Fig. 1).…”

Section: Methods Of Characterizing the Agingmentioning

confidence: 99%

Photooxidation of anhydride-cured epoxies: FTIR study of the modifications of the chemical structure

Ollier-Dureault

Gosse

1998

J. Appl. Polym. Sci.

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Anhydride-cured epoxies are used in electrical engineering to manufacture insulators. The purpose of this study is to determine the modifications undergone by these resins when exposed to solar-type radiation (radiation with a wavelength of more than 300 nm). Two epoxy-anhydride systems have been studied. Using transmission Fourier transform infrared (FTIR) and attenuated total reflection (ATR), we have determined the structural modifications and the groups formed during photooxidation. The degradation is very heterogeneous, more significant on the surface than in the bulk of the material, and a considerable decrease in almost all the initial functional groups is observed. The flexibilized system, richer in ester groups but containing fewer phenyl groups, degrades more rapidly during the first hours of exposure than the nonflexibilized system. Two explanations accounting for this faster degradation in the first hours of exposure are drawn from ultraviolet absorbance analysis and degradation mechanisms considerations. After 40 h of irradiation, the disappearance rate of the aromatic groups depends only on their initial concentration, whereas the formation kinetics for the hydroxyl groups is limited by the diffusion of oxygen in the material. Chemical treatments using SF 4 , NH 3 , and NaCl have revealed the formation of hydrophilic products, acids, and alcohols. Their presence and particularly high concentration at the surface could very well be responsible for the degradation of the insulating properties of the electrical insulators.

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“…Wave number (cn~) are due to the presence of methylene group and epoxide (C-H) group [8] respectively. The absorption bands at 1615, 1512 cm -1 are of phenyl rings and the bands at 1335 cm -I are due to the presence of tertiary amine group [9].…”

Section: Methodsmentioning

confidence: 99%

Comparative studies on the curing kinetics and thermal stability of tetrafunctional epoxy resins using various amines as curing agents

Patel

1993

Journal of Thermal Analysis

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The curing reactions of the epoxy resins tetraglycidyl diaminodiphenyl methane (TGDDM) and tetraglycidyl methylenebis (o-toluidine) (TGMBT) using diaminodiphenyl sulfone (DDS), diaminodiphenyl methane (DDM) and diethytenetriamine (DETA) as curing agents were studied kinetically by differential scanning calorimetry. The dynamic scans in the temperature range 20~176were analyzed to estimate the activation energy and the order of reaction for the curing process using some empirical relations. The activation energy for the various epoxy systems is observed in the range 71.9-110.2 kJ.mol -i. The cured epoxy resins were studied for kinetics of thermal degradation by thermogravimetry in a static air atmosphere at a heating rate of 10 deg.min -1. The thermal degradation reactions were found to proceed in a single step having an activation energy in the range 27.6-51.4 kJ.mol -I.

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Cure kinetics of a low epoxide/hydroxyl group‐ratio bisphenol a epoxy resin–anhydride system by infrared absorption spectroscopy

Cited by 104 publications

References 23 publications

Curing behavior and thermal properties of multifunctional epoxy resin with methylhexahydrophthalic anhydride

Curing behavior and thermal properties of multifunctional epoxy resin with methylhexahydrophthalic anhydride

Photooxidation of anhydride-cured epoxies: FTIR study of the modifications of the chemical structure

Comparative studies on the curing kinetics and thermal stability of tetrafunctional epoxy resins using various amines as curing agents

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