Cure kinetics and properties of high-performance epoxy thermosets cured with active ester-terminated poly (aryl ether ketone)

Abstract

Benzene-1,3,5-triyl tribenzoate (TBB), both 3,5-bis(benzoyloxy)benzoate-terminated poly (aryl ether ketone) oligomers (BPAPK and TMPK), containing active ester (Ph−O−(C=O)− structure), were prepared and served as curing agents for dicyclopentadiene novoalc epoxy (DCPD). The curing kinetics and properties of three epoxy thermosets were systematically investigated. The model reaction of TBB and glycidyl phenyl ether was designed to understand the curing mechanism of oxirane ring with active ester. TMPK/DCPD displays the lowest reaction activation energy, which is the result of the combined influence of free volume and diffusion. In addition, TMPK/DCPD has the highest Tg value (218°C), which enhances 34.6% and 42.5% compared with BPAPK/DCPD and TBB/DCPD, respectively. Meanwhile, TMPK/DCPD also shows superior dielectric and water resistance properties due to no secondary alcohol generated after curing and hydrophobic tetramethyl-substituted biphenyl structure. Herein, TMPK/DCPD as high-performance epoxy thermosets has potential applications in electronic packaging fields.

Investigation on the properties and structures of resveratrol-derived epoxy thermosets cured with an active ester

“…2a and b show the 1 H-NMR and 13 C-NMR spectra of REP. The synthesis of TAR and TTR was a basic esterification reaction, the experimental steps were referred to the relevant literature, 37 and the specific operations were adapted according to the experimental phenomena. Fig.…”

“…The bio-based epoxy thermosets were prepared by the curing reaction of the epoxy and active ester, the reaction process is shown in Scheme 2, and the reaction mechanism has been determined. 33,[35][36][37] The curing behaviour of the bio-based epoxy thermosets was investigated by DSC analysis and the non-isothermal DSC curves are shown in The internal groups of epoxy thermosets and the completion of the curing reaction were characterised by FTIR spectra. Fig.…”

“…On this basis, these advantages of active esters have been noticed and some research has been carried out. [33][34][35][36][37] However, most of the recent research studies used a large amount of solvents, for example NMP and DMAc were used in the curing process, and the evaporation of the solvent during the curing process would be harmful to the operators and the environment; in addition, due to the process of evaporation of the solvent, all the samples reported in the literature were small flakes with a thickness of 80-300 µm; [33][34][35] very thick samples cannot be prepared, or bubbles would appear. The use of solvents should be an option, not only be able to cure with solvents, which would limit the application of the materials.…”

Imine-Containing Epoxy Vitrimer Cured by Active Ester: Properties and Theoretical Analysis

“…In recent decades, with the rapid development of the electronic and electrical industry, the signal transmission of electronic devices is starting to pursue faster transmission speed and higher frequency, which requires substrate materials with better dielectric properties . Active ester as a special epoxy hardener, theoretically no hydroxyl group in the epoxy resin after curing, so the prepared epoxy resin would have low water absorption and good dielectric properties. − However, the development of the electronic appliance industry has brought great convenience to people, but at the same time, it has also generated a lot of electronic waste; proper recycling of electronic waste can conserve resources, protect the environment, and even generate revenue. , At present, the high-value metals in composites (like PCBs) can be recycled, but relatively low-value resin substrates are easy to ignore . To achieve sustainable development, the recycling of resin is also very important.…”

A mini‐review of ultra‐low dielectric constant intrinsic epoxy resins: Mechanism, preparation and application

“…Compared with the other epoxy-cured resins (3-TFM EP/MHHPA and 3-TFMEP/MHHPA/4-TFMBI), the 3-TFMEP/ 4-TFMBI cured resins had the lowest ε value(3.38, 10 MHz). This is because the CF 3 groups in the 3-TFMEP/4-TMFBMI cured resins are benefit to reduce the molecular polarizability of its curing networks, endowing the low ε.Meng et al46 successfully synthesized 3,5-bis(benzoyloxy)benzylterminated poly(aryletherketone) with the tetramethyl biphenyl groups (TMPK) through the polycondensation and esterification reactions, and then utilized TMPK as the curing agent to prepare DCPDE/ TMPK cured resins (Figure2B). And the hydroxyl-terminated poly(aryleketone) (BPAPK) and 1,3,5-benzenetricarboxylic acid (TBB) were also used as the cured agents to obtain DCPDE/BPAPK and DCPDE/TBB resins.…”