Cure behavior of a no flow underfill encapsulant

Hsu, D. T.; Kim, H.K.; Shi, Frank G.; Tong, Hui; Chungpaiboonpatana, S.; Davidson, C.L.; Adams, Judith

doi:10.1108/13565360010305949

Cited by 3 publications

(1 citation statement)

References 12 publications

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“…The final bonding conditions are also shown in Table I. (Hsu et al, 2000;Lau et al, 1998). The thermosetting-epoxy based ACF was tested using a modulated differential scanning calorimeter (MDSC 2910) with a computerized data acquisition system.…”

Section: Bonding Processmentioning

confidence: 99%

The effect of curing on the performance of ACF bonded chip‐on‐flex assemblies after thermal ageing

Rizvi

Chan

Bailey

et al. 2005

Soldering &Amp; Surface Mount Technology

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About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -Anisotropic conductive film (ACF) is now an attractive technology for direct mounting of chips onto the substrate as an alternative to leadfree solders. However, despite its various advantages over other technologies, it also has many unresolved reliability issues. For instance, the performance of ACF assembly in high temperature applications is questionable. The purpose of this paper is to study the effect of bonding temperatures on the curing of ACFs, and their mechanical and electrical performance after high temperature ageing. Design/methodology/approach -In the work presented in this paper, the curing degree of an ACF at different bonding temperatures was measured using a differential scanning calorimeter. The adhesion strength and the contact resistance of ACF bonded chip-on-flex assembly were measured before and after thermal ageing and the results were correlated with the curing degree of ACF. The ACF was an epoxy-based adhesive in which Au-Ni coated polymer particles were randomly dispersed. Findings -The results showed that higher bonding temperatures had resulted in better ACF curing and stronger adhesion. After ageing, the adhesion strength increased for the samples bonded at lower temperatures and decreased for the samples bonded at higher temperatures. ACF assemblies with higher degrees of curing showed smaller increases in contact resistance after ageing. Conduction gaps at the bump-particle and/or particle-pad interfaces were found with the help of scanning electron microscopy and are thought to be the root cause of the increase in contact resistance. Originality/value -The present study focuses on the effect of bonding temperatures on the curing of ACFs, and their adhesion strength and electrical performances after high temperature ageing. The results of this study may help the development of ACFs with higher heat resistance, so that ACFs can be considered as an alternative to lead-free solders.

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Section: Bonding Processmentioning

confidence: 99%