1996
DOI: 10.1016/0925-9635(95)00507-2
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Cubic boron nitride films by d.c. and r.f. magnetron sputtering: layer characterization and process diagnostics

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Cited by 76 publications
(30 citation statements)
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“…Various substrate bias voltages (U B ) were used for the deposition, resulting in polycrystalline pure-phase h-BN (U B ϾϪ100 V͒ or high c-BN content (U B ϽϪ100 V͒ thin films. 33 Pure h-BN and pure boron targets, or pure boron targets only were used as targets during the rf or dc magnetron sputtering process, respectively. The process with boron nitride as target was reactive.…”
Section: Methodsmentioning
confidence: 99%
“…Various substrate bias voltages (U B ) were used for the deposition, resulting in polycrystalline pure-phase h-BN (U B ϾϪ100 V͒ or high c-BN content (U B ϽϪ100 V͒ thin films. 33 Pure h-BN and pure boron targets, or pure boron targets only were used as targets during the rf or dc magnetron sputtering process, respectively. The process with boron nitride as target was reactive.…”
Section: Methodsmentioning
confidence: 99%
“…Both rf magnetron sputtering from a h-BN target or a pure boron target, and dc sputtering from a pure boron target, were used for the BN thin-film deposition. 17 With the boron target the process was reactive, where 10-sccm nitrogen and 90-sccm argon were sufficient for the growth of stoichiometric BN films. The gas flux during the process with the h-BN target was 3-sccm nitrogen and 97-sccm argon.…”
Section: Methodsmentioning
confidence: 99%
“…12 The samples were investigated by HRTEM and SAD. A noncubic nucleation layer was observed between the substrate and the high c-BN content layer in the c-BN thin films.…”
mentioning
confidence: 99%