Cu2O epitaxial films with domain structures prepared on Y-stabilized ZrO2 substrates by pulsed laser deposition

Liu, Xiaohui; Xu, Meng; Ma, Jin; Zhang, Xijian; Luan, Caìna; Feng, Xianjin; Song, Aimin

doi:10.1016/j.ceramint.2017.08.098

Cited by 10 publications

(3 citation statements)

References 36 publications

(43 reference statements)

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“…The most intense Raman shift of Cu 2 O at 220 cm –1 refers to the second order overtone of Cu 2 O. Other two broad Raman modes at 416 and 629 cm –1 can be assigned to one-fourth order overtone 4Γ 12 – and one red allowed mode Γ 15 –(2) . As for CoO nanosheets, there are discernible E g , F 2 g , and A 1 g peaks, belonging to the CoO phase. − The as-prepared Cu 2 O@CoO yolk–shell nanocubes display characteristic Raman modes of both Cu 2 O and CoO.…”

Section: Resultsmentioning

confidence: 97%

Cascade Electrocatalytic Nitrate Reduction Reaching 100% Nitrate-N to Ammonia-N Conversion over Cu₂O@CoO Yolk–Shell Nanocubes

Huang,

Luo,

Liu

et al. 2024

ACS Nano

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The electroreduction of nitrate to ammonia via a selective eight-electron transfer nitrate reduction reaction offers a promising, low energy consumption, pollution-free, green NH 3 synthesis strategy alternative to the Haber−Bosch method. However, it remains a great challenge to achieve high NH 4 + selectivity and complete conversion from NO 3 − −N to NH 4 + −N. Herein, we report ingredients adjustable Cu 2 O@CoO yolk−shell nanocubes featured with tunable inner void spaces and diverse activity centers, favoring the rapid cascade conversion of NO 3 − into NO 2 − on Cu 2 O and NO 2 − into NH 4 + on CoO. Cu 2 O@CoO yolk−shell nanocubes exhibit super NH 4+ Faradaic efficiencies (>99%) over a wide potential window (−0.2 V to −0.9 V versus RHE) with a considerable NH 4 + yield rate of 15.27 mg h −1 cm −2 and fantastic cycling stability and long-term chronoamperometric durability. Cu 2 O@CoO yolk−shell nanocubes exhibited glorious NO 3 − -N to NH 4 + −N conversion efficiency in both dilute (500 ppm) and highly concentrated (0.1 and 1 M) NO 3 − electrolytes, respectively. The nitrate electrolysis membrane electrode assembly system equipped with Cu 2 O@CoO yolk−shell nanocubes delivers over 99.8% NH 4+ Faradaic efficiency at cell voltages of 1.9−2.3 V.

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Section: Resultsmentioning

confidence: 97%

Cascade Electrocatalytic Nitrate Reduction Reaching 100% Nitrate-N to Ammonia-N Conversion over Cu₂O@CoO Yolk–Shell Nanocubes

Huang,

Luo,

Liu

et al. 2024

ACS Nano

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“…[62,63] For the Cu-removed sample (red line), prominent peaks of copper (I) oxide (Cu 2 O), and glass were exhibited, indicating that a Cu 2 O layer was formed at the Cu/glass interface. [64][65][66][67] This Cu 2 O layer could be induced via re-oxidation of the Cu conductor due to the interfacial photothermal heating, [59,[68][69][70] alleviating the atomic mismatch between flash-induced Cu and glass for highly robust Cu electrode. [71][72][73][74] Figure 1d presents the cross-sectional image of flash-activated Cu on a glass substrate, as analyzed by STEM and energy dispersive X-ray spectroscopy (EDS) mapping.…”

Section: Figure 1amentioning

confidence: 99%

A Flash‐Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin‐Film μLEDs

et al. 2021

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displays based on individual chip transfer have already been demonstrated in a 150 inch commercial TV on the Consumer Electronics Show (CES) 2020. However, due to the time-consuming and expensive process of multimillion individual chip transfer for UHD TV, chip-based μLED has limitation in the mass production of low-cost μLED displays. In contrast, thinfilm μLED based on mass transfer of more than 10 000 LED chips in one time has great potential to reduce the product price of μLED panels. [1-4] Although many innovative studies of thin-film μLED technologies have been performed, little effort has been devoted to the fundamental materials in μLED devices and their effect on performance, reliability, and adhesion control. Material issues with thin-film μLED are related to the epitaxial wafer, target substrate, electrode, transfer, and packaging. [3,5-19] Glass is currently one of the most widely used display substrates for TVs, smart phones, and tablet PCs. [20-23] Electrode materials for thin-film μLEDs on a glass substrate need to be carefully optimized to improve RC delay, power efficiency, stability, and production cost. Cu is an attractive material for thin-film μLED electrodes due to its remarkable conductivity (5.98 × 10 5 S cm-1), [24] high robustness, [25,26] and cheap price (≈6500 times cheaper than Au), [27] A robust Cu conductor on a glass substrate for thin-film μLEDs using the flash-induced chemical/physical interlocking between Cu and glass is reported. During millisecond light irradiation, CuO nanoparticles (NPs) on the display substrate are transformed into a conductive Cu film by reduction and sintering. At the same time, intensive heating at the boundary of CuO NPs and glass chemically induces the formation of an ultrathin Cu 2 O interlayer within the Cu/glass interface for strong adhesion. Cu nanointerlocking occurs by transient glass softening and interface fluctuation to increase the contact area. Owing to these flash-induced interfacial interactions, the flash-activated Cu electrode exhibits an adhesion energy of 10 J m −2 , which is five times higher than that of vacuum-deposited Cu. An AlGaInP thin-film vertical μLED (VLED) forms an electrical interconnection with the flash-induced Cu electrode via an ACF bonding process, resulting in a high optical power density of 41 mW mm −2. The Cu conductor enables reliable VLED operation regardless of harsh thermal stress and moisture infiltration under a high-temperature storage test, temperature humidity test, and thermal shock test. 50 × 50 VLED arrays transferred onto the flash-induced robust Cu electrode show high illumination yield and uniform distribution of forward voltage, peak wavelength, and device temperature.

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“…1) Due to its abundant stock in nature, low cost, nontoxicity, good mobility and high optical absorption coefficient in the visible light range, Cu 2 O is considered as a suitable functional material for various applications, including photocatalytic water splitting, 2),3) photolysis of dye molecules 4) and solar cells. 5),6) Various physical and chemical methods have been reported for the fabrication of Cu 2 O films, such as thermal oxidation, 7),8) RF sputtering, 9),10) pulsed laser deposition, 11), 12) chemical vapor deposition, 13), 14) spray pyrolysis, 15) sol-gel, 16) and electrochemical deposition. 17)- 19) However, films prepared using these methods often contain impurities like Cu, CuO, and Cu(OH) 2 , which negatively affect the film properties.…”

Section: Introductionmentioning

confidence: 99%

Crystallized Cu<sub>2</sub>O films fabricated at low substrate temperature of 50–90 °C by spin-spray method

Endo,

Nitta,

Kubota

et al. 2023

J. Ceram. Soc. Japan

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Crystalline Cu 2 O films were fabricated via the spin-spray method at substrate temperature (T s ) below 90 °C, without the post heat treatment. Grain size, crystal orientation and optical band gap controls of Cu 2 O films were achieved by changing T s . The film orientation was delicately tuned in sequence from {111} to {200} with T s increasing from 50 to 90 °C. The Cu 2 O film fabricated at T s of 70 °C had a film thickness of 1.19 ¯m and consisted of a columnar structure with an average diameter size of 0.8 ¯m. In contrast, the films fabricated at T s of 90 °C were composed of nanoparticles with diameters less than 0.1 ¯m. It was observed that a smaller grain size on the film surface corresponded to a wider optical band gap. Notably, the film fabricated at T s of 50 °C exhibited a relatively wide band gap of 2.97 eV due to the quantum size effect.

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Cu2O epitaxial films with domain structures prepared on Y-stabilized ZrO2 substrates by pulsed laser deposition

Cited by 10 publications

References 36 publications

Cascade Electrocatalytic Nitrate Reduction Reaching 100% Nitrate-N to Ammonia-N Conversion over Cu₂O@CoO Yolk–Shell Nanocubes

Cascade Electrocatalytic Nitrate Reduction Reaching 100% Nitrate-N to Ammonia-N Conversion over Cu₂O@CoO Yolk–Shell Nanocubes

A Flash‐Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin‐Film μLEDs

Crystallized Cu<sub>2</sub>O films fabricated at low substrate temperature of 50–90 °C by spin-spray method

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Cu2O epitaxial films with domain structures prepared on Y-stabilized ZrO2 substrates by pulsed laser deposition

Cited by 10 publications

References 36 publications

Cascade Electrocatalytic Nitrate Reduction Reaching 100% Nitrate-N to Ammonia-N Conversion over Cu2O@CoO Yolk–Shell Nanocubes

Cascade Electrocatalytic Nitrate Reduction Reaching 100% Nitrate-N to Ammonia-N Conversion over Cu2O@CoO Yolk–Shell Nanocubes

A Flash‐Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin‐Film μLEDs

Crystallized Cu<sub>2</sub>O films fabricated at low substrate temperature of 50–90 °C by spin-spray method

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Cascade Electrocatalytic Nitrate Reduction Reaching 100% Nitrate-N to Ammonia-N Conversion over Cu₂O@CoO Yolk–Shell Nanocubes

Cascade Electrocatalytic Nitrate Reduction Reaching 100% Nitrate-N to Ammonia-N Conversion over Cu₂O@CoO Yolk–Shell Nanocubes