2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2013
DOI: 10.1109/impact.2013.6706659
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Cu wire HAST fail mechanism investigation for BGA package

Abstract: The usage of copper wire is becoming more widespread in recent time. However, it is well known that copper wire is more critical compared to gold wire, in terms of wire bond workability and reliability. Especially, during HAST (Highly accelerated stress test) copper wire is sensitive for corrosion of the Cu-Al inter-metallic compound (IMC) resulting into ball lift failure. Therefore, the purpose of this paper is to study the root causes for HAST failures with copper wire bonding in BGA packages. Moreover, Cu-A… Show more

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Cited by 3 publications
(1 citation statement)
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“…Finally, the outgassing gets deposited at the bottom of window clamp with time. Meanwhile, few of the outgassing may drop to the bonding pad and substrate finger so that it negatively affects the wire bonding integrity (Chang et al, 2013). In fact, production line uncontrolled window clamp cleaning before, Non-stick on lead alarm and non-stick on pad alarm had significantly been reduced since window clamp was rinsed once per month.…”
Section: Substrate Outgassing Analysis During Wire Bondingmentioning
confidence: 99%
“…Finally, the outgassing gets deposited at the bottom of window clamp with time. Meanwhile, few of the outgassing may drop to the bonding pad and substrate finger so that it negatively affects the wire bonding integrity (Chang et al, 2013). In fact, production line uncontrolled window clamp cleaning before, Non-stick on lead alarm and non-stick on pad alarm had significantly been reduced since window clamp was rinsed once per month.…”
Section: Substrate Outgassing Analysis During Wire Bondingmentioning
confidence: 99%