Abstract:Purpose
The purpose of this paper is to design a novel die-attach composite joint for high-temperature die-attach applications based on transient liquid phase bonding. Moreover, the microstructure, shear strength, electrical property, thermal conductivity and aging property of the composite joint were investigated.
Design/methodology/approach
The composite joint was made of microporous copper and Cu3Sn. Microporous copper was immersed into liquid Sn to achieve Sn-microporous copper composite structure for di… Show more
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