Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging

Lee, Byung-Suk; Hyun, Soong‐Keun; Yoon, Jeong‐Won

doi:10.1007/s10854-017-6479-4

Cited by 58 publications

(21 citation statements)

References 19 publications

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“…These voids could significantly reduce the shear strength of the joints and weaken the interconnection. With the use of Sn coated Cu-MWCNT composite powders in the present work, the voids at the joints were reduced when compared to the conventional Cu/Sn foil/Cu TLP [23] and Cu/Sn coated Cu/Cu TLP [10]. This could be due to the flake-like morphology of the Sn-Cu-MWCNT composite.…”

Section: Cu + Sn → Cu 3 Snmentioning

confidence: 68%

Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics

et al. 2019

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In this paper, a novel transient liquid phase bonding material was fabricated by consequent electroless plating of Cu and Sn on a multi-walled carbon nanotube (MWCNT). The resulting Sn-Cu-MWCNT composites were used to join the Cu interconnects at 260°C. After 8 min of reflow time, a complete transformation of Cu3Sn intermetallic compound (IMC) occurred, leaving a Cu/MWCNT-Cu3Sn /Cu joint capable of withstanding the high operating temperature. Due to flake-like morphology, the Sn-Cu-MWCNT composite particles were well packed with lesser voids. The shear strength of the Cu/Cu3Sn-MWCNT/Cu joint was measured as 35.3 MPa, thus exhibiting the scope for replacing conventional transient liquid phase (TLP) powders in the future.

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Section: Cu + Sn → Cu 3 Snmentioning

confidence: 68%

Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics

et al. 2019

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“…2 shows the SEM micrographs of the cross-sectional analysis after Cu/Sn/Cu TLP bonding. According to the cross-sectional analysis at 10 minutes of bonding time, the IMCs formed in the bonding joint consisted of Cu 6 Sn 5 and Cu 3 Sn IMCs, which are known 13) to typi-cally form in the Cu-Sn system. In addition, when using the Sn preform not applied to Ar plasma surface treatment, residual Sn was remained after forming the IMCs at the bonding joint.…”

Section: Experimental Methodsmentioning

confidence: 99%

“…Furthermore, when using a Cu metal powder, it is difficult to solve the oxidation problem of the Cu material itself 10,12) . Accordingly, a transient liquid phase (TLP) bonding technology has been recently proposed to improve on the disadvantages of the soldering and sintering bonding methods 13) . TLP bonding forms intermetallic compounds (IMCs) at the bonding joint, which form through the diffusion of metal atoms at relatively low temperatures, while melting the low-melting-point insert metal that acts as a bonding material between the high-melting-point material 13) .…”

Section: Introductionmentioning

confidence: 99%

“…Accordingly, a transient liquid phase (TLP) bonding technology has been recently proposed to improve on the disadvantages of the soldering and sintering bonding methods 13) . TLP bonding forms intermetallic compounds (IMCs) at the bonding joint, which form through the diffusion of metal atoms at relatively low temperatures, while melting the low-melting-point insert metal that acts as a bonding material between the high-melting-point material 13) . The IMCs formed throughout the entire bonding joint can secure reliability even in high-temperature environments due to their high melting point.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module

Baek

Son

et al. 2020

Journal of Welding and Joining

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In this study, we investigated the effect of plasma treatment for the surface of an insert bonding metal on the properties of a transient liquid phase (TLP) bonding joint for a power module. Sn preforms, as the insert bonding metal for the TLP bonding, were used with and without Ar plasma treatment. To investigate the effect of Ar plasma treatment, the TLP bonding for two structures of Cu-finished Si chip/Sn preform/organic solderability preservative (OSP)-finished direct bond copper (DBC) substrate (Cu/Sn/Cu), and Ni-finished Si chip/Sn preform/Ni(P)-finished DBC substrate (Ni/Sn/Ni) was performed with 1 MPa at 300 ℃ and the bonding times were 10, 30, and 60 min, respectively. After the TLP bonding, we observed interfacial reactions and formations of intermetallic compounds (IMCs) under various bonding conditions. To evaluate mechanical properties, a shear test was also performed. Compared to the TLP bonding joint that used bare Sn preforms without Ar plasma treatment, growth of IMCs at the bonding joint that used Sn preforms with Ar plasma treatment occurred faster, and the IMCs could be formed through the entire joint despite the bonding time of 10 min. Meanwhile, by increasing the bonding time, Cu 6 Sn 5 and Cu 3 Sn were formed at the Cu/Sn/Cu TLP bonding joint, whereas Ni 3 Sn 4 , Ni-Sn-P, and Ni 3 P were observed at the Ni/Sn/Ni joint. In the case of the Cu/Sn/Cu joint, we observed that increasing Cu 3 Sn formation while increasing the bonding time could be beneficial to the shear strength of the joint. Further, shear strengths of the joint were not significantly changed under the bonding conditions after Ni 3 Sn 4 , Ni-Sn-P, and Ni 3 P IMCs were formed at the entire joint of the Ni/Sn/Ni.

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“…These studies focused on the realization of "dense" IMC bonding layer and high joint strength using a low-temperature and short-time bonding process based on interdiffusion control between the metal particles. The "dense" IMC joints might exhibit high strength at elevated temperatures; however, it has been reported that the stiffness and brittleness of the IMCs cause strength reduction or joint fracture through thermal cyclic operations [25][26][27][28][29].…”

Section: Introductionmentioning

confidence: 99%

Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach

et al. 2019

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We have proposed a low-temperature bonding technology utilizing the sintering of Cu particles with transient liquid-phase of Sn-based solder, called transient liquid-phase sintering (TLPS), as a die-attach solution for high-temperature power modules. A copper-intermetallic compound-resin (Cu-IMC-resin) microstructure, which consists of Cu particles connected with Cu–Sn intermetallic compounds (IMCs) partially filled with polyimide resin, is obtained by the pressureless TLPS process at 250 °C for 1 min using a novel Cu-solder-resin composite as the bonding material in a nitrogen atmosphere. Macro- and micro-deformation properties of the unique microstructure of the TLPS Cu-IMC-resin are evaluated by finite element analysis using a three-dimensional image reconstruction model. The macroscopic computational uniaxial tensile tests of the Cu-IMC-resin model reveal that the utilization of the IMCs and the addition of the easily-deformable resin facilitates the temperature-stability and low-stiffness of the mechanical properties. The microstructure exhibits a significantly low homogenized Young’s modulus (11 GPa). Microscopic investigations show that the local stresses are broadly distributed on the IMC regions under uniaxial macroscopic tensile displacement, indicating highly reliable performance of the joint within a specific macroscopic strain condition. Numerical and experimental investigations demonstrate the excellent thermal cyclic reliability of die-attached joints between silicon carbide chips and directly bonded copper substrate.

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Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging

Cited by 58 publications

References 19 publications

Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics

Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics

Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module

Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach

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