Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach

Wlanis, Thomas; Hammer, René; Ecker, Werner; Lhostis, S.; Sart, Clement; Gallois-Garreignot, Sebastien; Rebhan, Bernhard; Maier, Gerhard

doi:10.1016/j.microrel.2018.05.005

Cited by 12 publications

(2 citation statements)

References 35 publications

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“…Two-dimensional (2D) roughness metrics cannot comprehensively and accurately portray the morphology of coal surfaces, prompting researchers to shift from traditional 2D roughness analysis to a more exhaustive assessment using three-dimensional (3D) surface roughness parameters [ 30 , 31 ]. The 3D roughness parameter significantly deviates from the conventional 2D roughness single curve analysis, offering a more accurate reflection of the overall surface topography of the coal.…”

Section: Materials and Algorithmsmentioning

confidence: 99%

Three-Dimensional Pore Structure Characterization of Bituminous Coal and Its Relationship with Adsorption Capacity

Jia

Dong

et al. 2023

Materials

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Bituminous coal reservoirs exhibit pronounced heterogeneity, which significantly impedes the production capacity of coalbed methane. Therefore, obtaining a thorough comprehension of the pore characteristics of bituminous coal reservoirs is essential for understanding the dynamic interaction between gas and coal, as well as ensuring the safety and efficiency of coal mine production. In this study, we conducted a comprehensive analysis of the pore structure and surface roughness of six bituminous coal samples (1.19% < Ro,max < 2.55%) using various atomic force microscopy (AFM) techniques. Firstly, we compared the microscopic morphology obtained through low-pressure nitrogen gas adsorption (LP-N2-GA) and AFM. It was observed that LP-N2-GA provides a comprehensive depiction of various pore structures, whereas AFM only allows the observation of V-shaped and wedge-shaped pores. Subsequently, the pore structure analysis of the coal samples was performed using Threshold and Chen’s algorithms at ×200 and ×4000 magnifications. Our findings indicate that Chen’s algorithm enables the observation of a greater number of pores compared to the Threshold algorithm. Moreover, the porosity obtained through the 3D algorithm is more accurate and closely aligns with the results from LP-N2-GA analysis. Regarding the effect of magnification, it was found that ×4000 magnification yielded a higher number of pores compared to ×200 magnification. The roughness values (Rq and Ra) obtained at ×200 magnification were 5–14 times greater than those at ×4000 magnification. Interestingly, despite the differences in magnification, the difference in porosity between ×200 and ×4000 was not significant. Furthermore, when comparing the results with the HP-CH4-GA experiment, it was observed that an increase in Ra and Rq values positively influenced gas adsorption, while an increase in Rsk and Rku values had an unfavorable effect on gas adsorption. This suggests that surface roughness plays a crucial role in gas adsorption behavior. Overall, the findings highlight the significant influence of different methods on the evaluation of pore structure. The 3D algorithm and ×4000 magnification provide a more accurate description of the pore structure. Additionally, the variation in 3D surface roughness was found to be related to coal rank and had a notable effect on gas adsorption.

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Section: Materials and Algorithmsmentioning

confidence: 99%

Three-Dimensional Pore Structure Characterization of Bituminous Coal and Its Relationship with Adsorption Capacity

Jia

Dong

et al. 2023

Materials

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“…In the last few decades, multiple studies of hybrid bonding have been discussed from the perspective of analytical modeling 15 and Finite Element Analysis (FEA) simulations. [16][17][18][19][20] Here, we explore further the key process parameters and window of D2W hybrid bonding. The first step is the die/wafer fabrication.…”

mentioning

confidence: 99%

Mechanism and Process Window Study for Die-to-Wafer (D2W) Hybrid Bonding

Ren

Yang

Ouyang

et al. 2021

ECS J. Solid State Sci. Technol.

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Room temperature hybrid bonding is a good candidate to replace thermal compression bonding due to its better resistance to Cu oxidation and its capability for large die integration. However, the bonding mechanism with Cu thickness non-uniformity and real dishing conditions has not yet been fully understood. To study the mechanism and to explore the window of annealing temperature for the void-free interface, finite element analysis (FEA) and auxiliary experiments with real process issues have been conducted. A Cu thickness variation of 6.6% across the whole wafer after electroplating causes a metal dishing between 4 and 16 nm during chemical mechanical planarization. The critical stress (78.1 MPa) of dielectric material gives the upper boundary of temperature, and the complete contact of metal limits the lower boundary for our FEA models. The window for the annealing temperature is then simulated to be within a range between 295 °C and 302 °C. This is the first time that FEA with a non-uniform process input has been implemented to generate a process window of die-to-wafer (D2W) hybrid bonding for real world application. This paper provides a deep understanding and practical guidance for D2W hybrid bonding.

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Thermodynamic modeling framework with experimental investigation of the large-scale bonded area and local void in Cu-Cu bonding interface for advanced semiconductor packaging

Oh,

Lee,

Lee

et al. 2024

International Journal of Plasticity

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Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach

Cited by 12 publications

References 35 publications

Three-Dimensional Pore Structure Characterization of Bituminous Coal and Its Relationship with Adsorption Capacity

Three-Dimensional Pore Structure Characterization of Bituminous Coal and Its Relationship with Adsorption Capacity

Mechanism and Process Window Study for Die-to-Wafer (D2W) Hybrid Bonding

Thermodynamic modeling framework with experimental investigation of the large-scale bonded area and local void in Cu-Cu bonding interface for advanced semiconductor packaging

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