Cu–Ni–Sn–Si alloys designed by cluster-plus-glue-atom model

Yu, Qun; Li, X.N.; Wei, Kai; Li, Z.M.; Zheng, Yuehong; Li, N.J.; Cheng, Xinquan; Wang, C.Y.; Wang, Q.; Chen, Dong

doi:10.1016/j.matdes.2019.107641

Cited by 54 publications

(7 citation statements)

References 27 publications

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“…Due to differences in the melting points and surface tensions of the alloying elements in the Cu–Ni–Sn alloy, segregation of the alloying elements is easy to occur during casting, which directly affects the subsequent processing performance of the materials. The micro-segregation and some of the structural defects of the alloy ingot could be improved by the hot deformation process, and a suitable hot working process should be necessary for the Cu–9Ni–6Sn alloys to obtain good comprehensive performance [ 8 ]. The physical simulation test equipment for hot compression (the “Gleeble” series physical simulation test machine) is used to study the hot deformation behavior of the tested samples, and the hot working conditions of the alloy can be predicted according to the constitutive equation and the hot working diagram established in the dynamic material model (DDM) of hot compression simulations [ 9 ].…”

Section: Introductionmentioning

confidence: 99%

Experimental and Numerical Studies on Hot Compressive Deformation Behavior of a Cu–Ni–Sn–Mn–Zn Alloy

et al. 2023

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Cu–9Ni–6Sn alloys have received widespread attention due to their good mechanical properties and resistance to stress relaxation in the electronic and electrical industries. The hot compression deformation behaviors of the Cu–9Ni–6Sn–0.3Mn–0.2Zn alloy were investigated using the Gleeble-3500 thermal simulator at a temperature range of 700–900 °C and a strain rate range of 0.001–1 s−1. The microstructural evolution of the Cu–9Ni–6Sn alloy during hot compression was studied by means of an optical microscope and a scanning electron microscope. The constitutive equation of hot compression of the alloy was constructed by peak flow stress, and the corresponding 3D hot processing maps were plotted. The results showed that the peak flow stress decreased with the increase in the compression temperature and the decrease in the strain rate. The hot deformation activation energy was calculated as 243.67 kJ/mol by the Arrhenius equation, and the optimum deformation parameters for the alloy were 740–760 °C and 840–900 °C with a strain rate of 0.001~0.01 s−1. According to Deform-3D finite element simulation results, the distribution of the equivalent strain field in the hot deformation samples was inhomogeneous. The alloy was more sensitive to the deformation rate than to the temperature. The simulation results can provide a guideline for the optimization of the microstructure and hot deformation parameters of the Cu–9Ni–6Sn–0.3Mn–0.2Zn alloy.

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Section: Introductionmentioning

confidence: 99%

Experimental and Numerical Studies on Hot Compressive Deformation Behavior of a Cu–Ni–Sn–Mn–Zn Alloy

et al. 2023

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“…The results showed that DP can be successfully inhibited by these elements' addition. In addition, the addition of Ti [12], Si [13,14], Nb [15,16] , V [17], and Fe [18] can also effectively prevent the formation of DP in the Cu-15Ni-8Sn alloy. Research on the impact of micro-alloying on the Cu-15Ni-8Sn alloy's stress relaxation resistance is rare, though.…”

Section: Introductionmentioning

confidence: 99%

Effect of Co/P micro-alloying on stress relaxation behaviour of Cu-15Ni-8Sn alloy

Gong

Guo

Huang

et al. 2023

Materials Science and Technology

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To improve the stress relaxation resistance of the Cu-5Ni-S8n alloy, the effects of Co or P addition on its stress relaxation resistance were investigated by scanning electron microscopy, transmission electron microscopy, electron backscatter diffraction), X-ray diffraction, and high-temperature creep durability tester. The results revealed that the relaxation rate increased dramatically as the temperature rose. The thermal stress relaxation resistance of Cu-15Ni-8Sn alloy was significantly improved with Co addition; After 100 h of stress relaxation tests at 200°C or 250°C, the residual stress value of the Cu-15Ni-8Sn alloy increased by 23 MPa or 22 MPa with Co addition, which was associated with the consumption of vacancies by Co atoms and the pinning effect of Co atoms on dislocation. However, at 250°C, the stress relaxation resistance of the Cu-15Ni-8Sn-0.2P alloy was lower than that of the Cu-15Ni-8Sn alloy. This difference was due to the inclusion of P, which promoted the recrystallization reaction. Article highlights Recrystallization and the decrease of dislocation density are the major reasons for the stress relaxation of the samples. The stress relaxation resistance of Cu-15Ni-8Sn alloy was significantly improved with Co addition. The addition of the P element is not conducive to the improvement of thermal stress relaxation resistance.

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“…This method can be used to understand the structure of binary and multicomponent alloys from a new perspective and provide effective theoretical guidance for the composition design of multicomponent alloys. At present, the model has been successfully applied to Cu-based alloys [ 26 , 27 ], Ni-based fillers [ 24 ] and Sn-based lead-free solders [ 25 , 28 ].…”

Section: Introductionmentioning

confidence: 99%

Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

et al. 2021

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The mechanical properties of solder alloys are a performance that cannot be ignored in the field of electronic packaging. In the present study, novel Sn-Zn solder alloys were designed by the cluster-plus-glue-atom (CPGA) model. The effect of copper (Cu) addition on the microstructure, tensile properties, wettability, interfacial characterization and melting behavior of the Sn-Zn-Cu solder alloys were investigated. The Sn29Zn4.6Cu0.4 solder alloy exhibited a fine microstructure, but the excessive substitution of the Cu atoms in the CPGA model resulted in extremely coarse intermetallic compound (IMC). The tensile tests revealed that with the increase in Cu content, the tensile strength of the solder alloy first increased and then slightly decreased, while its elongation increased slightly first and then decreased slightly. The tensile strength of the Sn29Zn4.6Cu0.4 solder alloy reached 95.3 MPa, which was 57% higher than the plain Sn-Zn solder alloy, which is attributed to the fine microstructure and second phase strengthening. The spreadability property analysis indicated that the wettability of the Sn-Zn-Cu solder alloys firstly increased and then decreased with the increase in Cu content. The spreading area of the Sn29Zn0.6Cu0.4 solder alloy was increased by 27.8% compared to that of the plain Sn-Zn solder due to Cu consuming excessive free state Zn. With the increase in Cu content, the thickness of the IMC layer decreased owing to Cu diminishing the diffusion force of Zn element to the interface.

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Cu–Ni–Sn–Si alloys designed by cluster-plus-glue-atom model

Cited by 54 publications

References 27 publications

Experimental and Numerical Studies on Hot Compressive Deformation Behavior of a Cu–Ni–Sn–Mn–Zn Alloy

Experimental and Numerical Studies on Hot Compressive Deformation Behavior of a Cu–Ni–Sn–Mn–Zn Alloy

Effect of Co/P micro-alloying on stress relaxation behaviour of Cu-15Ni-8Sn alloy

Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

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