Cu/Dielectric hybrid bonding among Glass and Si

Cheemalamarri, Hemanth Kumar; Sundaram, Arvind; Van Nhat Anh, Tran; Jae Ok, Yoo; Rao, Vempati Srinivasa; Singh, Navab

doi:10.1109/ectc51529.2024.00396

2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024

DOI: 10.1109/ectc51529.2024.00396

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Cu/Dielectric hybrid bonding among Glass and Si

Hemanth Kumar Cheemalamarri,

Arvind Sundaram,

Tran Van Nhat Anh

et al.

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Cu/Dielectric hybrid bonding among Glass and Si

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References 14 publications

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