Abstract:In 2009, a crystalline oxide semiconductor with a layered structure, which we refer to as c‐axis–aligned crystalline indium‐gallium‐zinc oxide (CAAC‐IGZO), was first discovered. CAAC‐IGZO has a peculiar crystal structure in which clear grain boundaries are not observed despite high c‐axis alignment and absence of a‐b plane alignment. When compared to a Si field‐effect transistor (FET), a metal‐oxide‐semiconductor (MOS) FET, utilizing CAAC‐IGZO, presents lower off‐state current (on the order of yA [10−24 A]). T… Show more
“…In this regard, the IGZO with c -axis preferential orientation is an interesting material, which is known as c -axis-aligned crystalline (CAAC)-IGZO. Though the CAAC IGZO is not an amorphous phase, the thin-film transistors (TFTs) with a CAAC-IGZO channel layer exhibits the excellent threshold voltage ( V TH ) uniformity in the resulting thin-film transistors . The standard deviation (1σ) of ∼35 mV for the CAAC-IGZO with a gate length of 40 nm is comparable to that of the current Si metal–oxide–semiconductor field-effect transistor (MOSFET).…”
The
effect of gallium (Ga) concentration on the structural evolution of atomic-layer-deposited
indium gallium oxide (IGO) (In1–x
Ga
x
O) films as high-mobility n-channel
semiconducting layers was investigated. Different Ga concentrations
in 10–13 nm thick In1–x
Ga
x
O films allowed versatile phase structures to
be amorphous, highly ordered, and randomly oriented crystalline by
thermal annealing at either 400 or 700 °C for 1 h. Heavy Ga concentrations
above 34 atom % caused a phase transformation from a polycrystalline
bixbyite to an amorphous IGO film at 400 °C, while proper Ga
concentration produced a highly ordered bixbyite crystal structure
at 700 °C. The resulting highly ordered In0.66Ga0.34O film show unexpectedly high carrier mobility (μFE) values of 60.7 ± 1.0 cm2 V–1 s–1, a threshold voltage (V
TH) of −0.80 ± 0.05 V, and an I
ON/OFF ratio of 5.1 × 109 in field-effect
transistors (FETs). In contrast, the FETs having polycrystalline In1–x
Ga
x
O
films with higher In fractions (x = 0.18 and 0.25)
showed reasonable μFE values of 40.3 ± 1.6 and
31.5 ± 2.4 cm2 V–1 s–1, V
TH of −0.64 ± 0.40 and
−0.43 ± 0.06 V, and I
ON/OFF ratios of 2.5 × 109 and 1.4 × 109, respectively. The resulting superior performance of the In0.66Ga0.34O-film-based FET was attributed to a morphology
having fewer grain boundaries, with higher mass densification and
lower oxygen vacancy defect density of the bixbyite crystallites.
Also, the In0.66Ga0.34O transistor was found
to show the most stable behavior against an external gate bias stress.
“…In this regard, the IGZO with c -axis preferential orientation is an interesting material, which is known as c -axis-aligned crystalline (CAAC)-IGZO. Though the CAAC IGZO is not an amorphous phase, the thin-film transistors (TFTs) with a CAAC-IGZO channel layer exhibits the excellent threshold voltage ( V TH ) uniformity in the resulting thin-film transistors . The standard deviation (1σ) of ∼35 mV for the CAAC-IGZO with a gate length of 40 nm is comparable to that of the current Si metal–oxide–semiconductor field-effect transistor (MOSFET).…”
The
effect of gallium (Ga) concentration on the structural evolution of atomic-layer-deposited
indium gallium oxide (IGO) (In1–x
Ga
x
O) films as high-mobility n-channel
semiconducting layers was investigated. Different Ga concentrations
in 10–13 nm thick In1–x
Ga
x
O films allowed versatile phase structures to
be amorphous, highly ordered, and randomly oriented crystalline by
thermal annealing at either 400 or 700 °C for 1 h. Heavy Ga concentrations
above 34 atom % caused a phase transformation from a polycrystalline
bixbyite to an amorphous IGO film at 400 °C, while proper Ga
concentration produced a highly ordered bixbyite crystal structure
at 700 °C. The resulting highly ordered In0.66Ga0.34O film show unexpectedly high carrier mobility (μFE) values of 60.7 ± 1.0 cm2 V–1 s–1, a threshold voltage (V
TH) of −0.80 ± 0.05 V, and an I
ON/OFF ratio of 5.1 × 109 in field-effect
transistors (FETs). In contrast, the FETs having polycrystalline In1–x
Ga
x
O
films with higher In fractions (x = 0.18 and 0.25)
showed reasonable μFE values of 40.3 ± 1.6 and
31.5 ± 2.4 cm2 V–1 s–1, V
TH of −0.64 ± 0.40 and
−0.43 ± 0.06 V, and I
ON/OFF ratios of 2.5 × 109 and 1.4 × 109, respectively. The resulting superior performance of the In0.66Ga0.34O-film-based FET was attributed to a morphology
having fewer grain boundaries, with higher mass densification and
lower oxygen vacancy defect density of the bixbyite crystallites.
Also, the In0.66Ga0.34O transistor was found
to show the most stable behavior against an external gate bias stress.
“…Films with thicknesses 100–300 nm were fabricated on quartz substrates by the sputtering method. 9,10,42–44 A polycrystalline substance with In, Ga, and Zn at an atomic ratio of 1 : 1 : 1 was used as the target. The conditions for dc-magnetron sputtering were as follows: the deposition power density was 0.87 W cm −1 and the deposition pressure was 0.4 Pa with a O 2 /(Ar + O 2 ) gas flow rate of 0.33.…”
Section: Single-crystalline and C-axis-aligned Crystal Thin Filmmentioning
Compounds composed of In-Ga-Zn-O (IGZO) have characteristic homologous crystal structures represented by the following general formula: (InGaO3)m(ZnO)n. Such compounds have been applied in many fields since the discovery that amorphous...
“…24 Modeling anomalous X-ray scattering showed a preserved middle range order originating from the InO x planes aligned parallel to GaZnO y slabs. 25,26 The remaining periodicity along the c-axis resembles the hexagonal structure of monocrystalline IGZO.…”
Section: ■ Introductionmentioning
confidence: 99%
“…1 In particular, the absence of mobile holes leads to extremely low off-currents (I off ) in junction-free field-effect transistors, 2 enabling long charge retention times in optical display systems as well as dynamic random-access memory (DRAM) cells. 3 Since the first applications in transparent thin-film transistors (TFTs), the performance of IGZO channels is correlated with their different morphologies: crystalline and amorphous. The amorphous phase is beneficial due to its low deposition temperature and the preservation of relatively high electron mobility compared to the crystalline material.…”
Section: ■ Introductionmentioning
confidence: 99%
“…Oxides of the In–Ga–Zn family (IGZO) gained a lot of interest as high band gap semiconductors and are applied as channels in thin-film devices . In particular, the absence of mobile holes leads to extremely low off-currents ( I off ) in junction-free field-effect transistors, enabling long charge retention times in optical display systems as well as dynamic random-access memory (DRAM) cells . Since the first applications in transparent thin-film transistors (TFTs), the performance of IGZO channels is correlated with their different morphologies: crystalline and amorphous.…”
Polycrystalline indium−gallium−zinc oxide (IGZO) in the spinel phase was obtained by physical vapor deposition (PVD), using reactive sputtering from an IGZO target with In/Ga/ Zn = 1:1:1 composition. The initial growth of spinel IGZO is investigated by X-ray diffraction measurements after annealing the film. Deposition of spinel IGZO initially starts as a mixed amorphous/c-axis-aligned crystalline (CAAC) film, after which a metastable spinel IGZO is formed. Using a template of polycrystalline spinel Ga 2 ZnO 4 , the growth of the spinel phase is immediately achieved and enables the electrical characterization of pure spinel IGZO channels in scaled thin-film field-effect transistors. The average effective channel field-effect mobility of spinel IGZO of 50 ± 10 cm 2 /(V s) is slightly higher than amorphous IGZO in the same devices. This is in line with a slightly lower effective electron mass, as is calculated with density functional theory. The calculated total energies and band gaps have similar values to CAAC-IGZO. This metastable nature identifies spinel IGZO as an intermediate phase before the onset of CAAC-IGZO formation during PVD. Spinel IGZO is an interesting alternative to amorphous IGZO (a-IGZO) and CAAC-IGZO because of potentially higher robustness to oxygen vacancy formation.
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