Crystal growth on novel Cu electroplating using suspension of supercritical CO 2 in electrolyte with Cu particles

Shimizu, Tetsuya; Shinoda, Nao; Chang, Tso-Fu Mark; Shibata, Akinobu; Sone, Masato

doi:10.1016/j.surfcoat.2012.03.058

Cited by 18 publications

(14 citation statements)

References 12 publications

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“…14(b). This result was unexpected because a current density of 1.41 A/dm 2 with the batch system was enough for the complete coverage of the TEG surface with electrodeposited Cu and also for the filling of the nanovias, reported in previous studies [30][31][32]. The mechanism causing this phenomenon is still not clarified yet.…”

Section: Cu Electrodeposition On Large-scale Tegmentioning

confidence: 84%

“…Fig. 2 shows the dispersion state of the SCE with the Cu electrolyte [30]. Without agitation, the electrolyte and scCO 2 were completely separated.…”

Section: The Dispersion States Of Scementioning

confidence: 99%

“…10 are both single crystals, and the electrodeposited Cu inside the two vias from the upper right shows few twin boundaries parallel to the bottom surface of the TEG. These twin boundaries in the electrodeposited Cu were confirmed to be Cu crystal along [111] crystallographic orientation by dark-field image and bright-field image of TEM [30]. Studies have shown that void-free and complete filling of Cu into nanoscaled vias are usually caused by the bottom-up growth and the conformal growth mechanisms, and the conformal growth is not suitable for the filling of Cu into nanosized vias by electrodeposition [8].…”

Section: Application Of Ed-scs In the Filling Of Nanoscale Viasmentioning

confidence: 99%

“…In the previous section, the electrodeposition method using SCS (ED-SCS) has been proved to be effective in allowing the complete filling of Cu into nanoscale vias [30][31][32]. The vias were 70 nm in diameter with an aspect ratio of 5, and the electrolyte used was a commercial available copper sulfate-based electrolyte design to fill vias with aspect ratio of 1.…”

Section: Application Of Ed-scs Into Nanoscale Wiring With Large-area mentioning

confidence: 99%

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Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte

Sone

2015

Electroplating of Nanostructures

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Novel electrodeposition (ED) techniques utilizing supercritical carbon dioxide (scCO 2 ) emulsions (SCE) are introduced. ScCO 2 has low surface tension and high compatibility with hydrogen. Thus, this method is applied in fine Cu wiring to allow the complete filling of Cu into nanoscale confined space. The electrochemical reactions are carried out in emulsions composed of an aqueous electrolyte, scCO 2 , and surfactants. Three aspects in fine Cu wiring will be introduced, which are the dissolution of the Cu seed layer in the SCE, the gap-filling capability of the ED-SCE, and the contamination in the plated Cu. At first, the dissolution of the Cu seed layer in the SCE was observed. In order to prevent the dissolution of the Cu seed layer, the addition of Cu particles into the SCE was found to be effective. The electrolyte containing the SCE and the Cu particles is named scCO 2 suspension (SCS). The gapfilling capability was evaluated using test element groups (TEGs) with patterns of vias with a diameter of 70 nm and an aspect ratio of 5. Many defects were observed in the vias filled using the conventional electrodeposition (CONV) method. On the other hand, defect-free fillings were obtained by the ED-SCS method. Because of the highpressure environment needed to form the scCO 2 , the reaction cells are usually batchtype high-pressure vessels. In order to improve the feasibility of the ED-SCS technique, a continuous-flow reaction system is also proposed and examined using a round-type large-area TEG with a diameter of 300 mm. Complete fillings were obtained for vias with a diameter of 60 nm and an aspect ratio of 5 on the large-area TEG. This result was in good agreement with that of the batch-type reaction system and demonstrated the successful application of the continuous-flow system with ED-SCS.

show abstract

Section: Cu Electrodeposition On Large-scale Tegmentioning

confidence: 84%

“…Fig. 2 shows the dispersion state of the SCE with the Cu electrolyte [30]. Without agitation, the electrolyte and scCO 2 were completely separated.…”

Section: The Dispersion States Of Scementioning

confidence: 99%

Section: Application Of Ed-scs In the Filling Of Nanoscale Viasmentioning

confidence: 99%

Section: Application Of Ed-scs Into Nanoscale Wiring With Large-area mentioning

confidence: 99%

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Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte

Sone

2015

Electroplating of Nanostructures

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“…In 2003, Sone et al introduced the supercritical carbon dioxide (SC-CO 2 ) to the electroplating process and achieved a uniform surface, adequate grain size, and higher hardness of the nickel coating [13] . They have recently reported that the changes in pressure conditions can influence grain structure of Cu films and found that the periodic plating characteristic (PPC) exists in the SC-CO 2 electroplating process [14] , [15] , [16] , [17] , [18] , [19] , [20] . Similarly, Li et al also used an emulsified SC-CO 2 bath for the high aspect ratio micro-hole filling in Ni-P alloy [21] .…”

Section: Introductionmentioning

confidence: 99%

Influence of ultrasonic combined supercritical-CO2 electrodeposition process on copper film fabrication: Electrochemical evaluation

Pandiyarajan

Hsiao

Liao

et al. 2021

Ultrasonics Sonochemistry

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High-performance anti-corrosion behavior of graphene oxide decorated nickel coating by novel ultrasonic-assisted supercritical-CO2 electrodeposition approach

Pandiyarajan

Liu

Liao

et al. 2021

Electrochimica Acta

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Crystal growth on novel Cu electroplating using suspension of supercritical CO 2 in electrolyte with Cu particles

Cited by 18 publications

References 12 publications

Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte

Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte

Influence of ultrasonic combined supercritical-CO2 electrodeposition process on copper film fabrication: Electrochemical evaluation

High-performance anti-corrosion behavior of graphene oxide decorated nickel coating by novel ultrasonic-assisted supercritical-CO2 electrodeposition approach

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