2014
DOI: 10.1117/12.2041279
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Cryogenic ultra-high power infrared diode laser bars

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Cited by 10 publications
(33 citation statements)
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“…Contact via copper foil enables many different bar geometries to be rapidly assessed, but adds additional packaging resistance of R p ~ 200 µΩ, comparable to the resistance of the bar itself, R. The copper plate contact reduces R p to ~ 10 µΩ. For studies into improved bar performance, copper foil contact is typically used for lower cost and faster and more flexible assembly, with R p subtracted after testing to reveal the performance of the bar itself, at the risk of introducing errors if R p varies [10]. At DILAS, LDA packaged QCW bars are a standard product, with state of the art power and efficiency, based on commercial diode laser bars with L = 1.5...2.0 mm [4][5]8].…”
Section: °C Performance Progress Of Laser Diode Assembliesmentioning
confidence: 98%
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“…Contact via copper foil enables many different bar geometries to be rapidly assessed, but adds additional packaging resistance of R p ~ 200 µΩ, comparable to the resistance of the bar itself, R. The copper plate contact reduces R p to ~ 10 µΩ. For studies into improved bar performance, copper foil contact is typically used for lower cost and faster and more flexible assembly, with R p subtracted after testing to reveal the performance of the bar itself, at the risk of introducing errors if R p varies [10]. At DILAS, LDA packaged QCW bars are a standard product, with state of the art power and efficiency, based on commercial diode laser bars with L = 1.5...2.0 mm [4][5]8].…”
Section: °C Performance Progress Of Laser Diode Assembliesmentioning
confidence: 98%
“…1. At the FBH, two different gold-plated copper heatsinks were used, termed CCPs or CS-mounts [10]. The diode laser bars are first mounted junction side down with hard solder between two expansion-matched CuW carriers, which are then mounted onto the CCP.…”
Section: °C Performance Progress Of Laser Diode Assembliesmentioning
confidence: 99%
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