Crown ethers as new curing agents for epoxy resins

Abstract

Different crown ethers (4-aminobenzo-15-crown-5 (4-aminobenzo-15-C5), 1,4,10,13-tetraoxa-7,16-diazacyclooctadecane (diaza-18-crown-6), tetraazacyclododecane-1,4,7,10-tetraacetic acid (H 4 DOTA) and tetraazacyclododecane-1,4,7,10tetraacetamide (H 2 ODDA)) were used as curing agent for bisphenol A diglycidyl ether (BADGE, n = 0). The maximum enthalpy change for all systems except that formed by the epoxy resin with H 4 DOTA corresponds to a stoichiometric ratio, since from this value the reaction enthalpies decrease when the proportion of epoxy increases. Heteropolymerization reaction occurs in all the crown ethers. Etherification reactions occur at temperatures much lower (30 ∘ C less) than for the porphyrin systems studied in which a second signal appears at 300 ∘ C. The etherification is evidenced by a slight shoulder in the thermograms for H 4 DOTA and H 2 ODDA. The systems BADGE (n = 0)/4-aminobenzo-15-C5 and BADGE (n = 0)/diaza-18-crown-6 improve the thermal stability of the epoxy resin by 30 ∘ C approximately while the improvement for BADGE (n = 0)/H 4 DOTA and BADGE (n = 0)/H 2 ODDA is about 60 ∘ C. RESULTS AND DISCUSSIONExamples of the dynamic experiments of the polymer (BADGE, n = 0)/crown ether are shown in Fig. 2.

Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging

“…Epoxy resins have gained broad use in electronic applications due to their beneficial properties such as excellent adhesion, low shrinkage, low dielectric constant, and outstanding mechanical and thermal properties . Recently, an epoxy‐based adhesive was utilized for interconnect technology involved with electrical interconnections in electronics such as semiconductor packaging .…”