Crosstalk Reduction in High-Density Radio Frequency Printed Circuit Boards: Leveraging FR4 Coating Layers
Vaidotas Barzdenas,
Aleksandr Vasjanov
Abstract:The escalating component density in radio frequency (RF) systems presents a growing challenge related to the coupling of adjacent microstrip lines in high-density printed circuit boards (PCBs). As a result, to tackle this prominent issue, there is a continuous pursuit of innovative techniques to effectively minimize the coupling effects among closely spaced microstrip lines. This paper proposes a reduction in the coupling of adjacent lines by utilizing a coating (stiffener) layer, which is commonly used in rig… Show more
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