Crosstalk analysis by fast computational algorithms

Qian, Zhiguo; Xiong, Jin; Sun, Lin; Chiang, I-Ting; Chew, Weng Cho; Jiang, Li Jun; Chu, Yunhui

doi:10.1109/epep.2005.1563782

Cited by 12 publications

(6 citation statements)

References 3 publications

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“…c) Matrix is equal to matrix in each layer (12) in which is the layer thickness. Therefore, based on b) and c), the following equality holds true: (13) d) Matrix is linearly proportional to the layer thickness.…”

Section: Reduction Of the 3-d Layered System Matrixmentioning

confidence: 96%

“…Having realized the importance of full-wave electromagnetic analysis in high frequency chip design, and the unique modeling challenges of IC problems, researchers in both circuit and fields have been working on developing innovative electromagnetic solutions [2]- [13]. However, most of the research efforts have been placed on enriching existing electromagnetic modeling techniques with new capabilities to address on-chip intricacy.…”

Section: Introductionmentioning

confidence: 99%

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A Layered Finite Element Method for Electromagnetic Analysis of Large-Scale High-Frequency Integrated Circuits

Jiao

Chakravarty

Dai

2007

IEEE Trans. Antennas Propagat.

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A high-capacity electromagnetic solution, layered finite element method, is proposed for high-frequency modeling of large-scale three-dimensional on-chip circuits. In this method, first, the matrix system of the original 3-D problem is reduced to that of 2-D layers. Second, the matrix system of 2-D layers is further reduced to that of a single layer. Third, an algorithm of logarithmic complexity is proposed to further speed up the analysis. In addition, an excitation and extraction technique is developed to limit the field unknowns needed for the final circuit extraction to a single layer only, as well as keep the right-hand side intact during the matrix reduction process. The entire procedure is numerically rigorous without making any theoretical approximation. The computational complexity only involves solving a single layer irrespective of the original problem size. Hence, the proposed method is equipped with a high capacity to solve large-scale IC problems. The proposed method was used to simulate a set of large-scale interconnect structures that were fabricated on a test chip using conventional Si processing techniques. Excellent agreement with the measured data has been observed from dc to 50 GHz.Index Terms-Electromagnetics, finite element method, high capacity, high frequency, on-chip circuits, three dimension.

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Section: Reduction Of the 3-d Layered System Matrixmentioning

confidence: 96%

Section: Introductionmentioning

confidence: 99%

A Layered Finite Element Method for Electromagnetic Analysis of Large-Scale High-Frequency Integrated Circuits

Jiao

Chakravarty

Dai

2007

IEEE Trans. Antennas Propagat.

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show abstract

“…We then denote and as (22) The reduced matrix can then be obtained from the original one as the following: (23) By repeatedly applying the aforementioned reduction procedure, we obtain a matrix that only involves unknowns in the first and last segment, which can be readily solved.…”

Section: Junction-matrix Acceleration Techniquementioning

confidence: 99%

“…The multilayered dielectric has not yet been accounted for. Integral equation based methods have also been developed in [22]- [26] for the application to on-chip problems. It is expected that an integral equation based solution that takes all the on-chip intricacies into consideration, and accelerated by the fast algorithms will soon be completed.…”

mentioning

confidence: 99%

A Fast Frequency-Domain Eigenvalue-Based Approach to Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect Structures

Jiao

Zhu

Chakravarty

2008

IEEE Trans. Adv. Packag.

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S., "A fast frequency-domain eigenvalue-based approach to full-wave modeling of large-scale three-dimensional on-chip interconnect structures" (2008) Abstract-As on-chip circuits have scaled into the deep submicron regime, electromagnetics-based analysis has increasingly become essential for high-performance integrated circuit (IC) design. Not only fast, but also high-capacity electromagnetic solutions are demanded to overcome the large problem size facing on-chip design community. In this paper, we present a novel, high-capacity, and fast approach to the full-wave modeling of 3-D on-chip interconnect structures. In this approach, the interconnect structure is decomposed into a number of seeds. In each seed, the original wave propagation problem is represented as a generalized eigenvalue problem. The resulting eigenvalue representation can comprehend both conductor and dielectric losses, arbitrary dielectric and conductor configuration in the transverse cross section, and arbitrary material. A new mode-matching technique applicable to on-chip interconnects is developed to solve large-scale 3-D problems by using 2-D-like CPU time and memory. A junction matrix acceleration technique is proposed to speed up the mode matching process. A fast frequency sweep technique is employed to obtain the response over the entire frequency band by solving at one or a few frequency points only. An extraction technique is developed to obtain S-parameters from the solution of the eigenvalue system. The entire procedure is numerically rigorous without making any theoretical approximation. Experimental and numerical results demonstrate its accuracy and efficiency.

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“…In the past three decades, driven by the continuous scaling of feature sizes and frequency, on-chip circuits have witnessed a series of transitions in modeling technology: from R (resistance)based, RC (resistance-capacitance)-based, distributed RC-based, and RLC (resistance-inductance-capacitance)-based to transmission-line-based to full-wave electromagnetics-based analysis [1][2][3][4][5][6][7][8]. The increased level of integration across the entire electromagnetic spectrum necessitates the electromagnetics-based analysis even more.…”

Section: Introductionmentioning

confidence: 99%

An alternative analytical reduction scheme in the time‐domain layered finite element reduction recovery method for high‐frequency IC design

Gan

Jiao

2008

Micro & Optical Tech Letters

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Crosstalk analysis by fast computational algorithms

Abstract: In this paper, we will present the use of low frequency fast algorithms for crosstalk analysis. Some criss-cross line structures are studied and time domain signals are demonstrated to ascertain crosstalk effect.

Cited by 12 publications

References 3 publications

A Layered Finite Element Method for Electromagnetic Analysis of Large-Scale High-Frequency Integrated Circuits

A Layered Finite Element Method for Electromagnetic Analysis of Large-Scale High-Frequency Integrated Circuits

A Fast Frequency-Domain Eigenvalue-Based Approach to Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect Structures

An alternative analytical reduction scheme in the time‐domain layered finite element reduction recovery method for high‐frequency IC design

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