2005
DOI: 10.1002/pola.21184
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Crosslinked epoxy materials exhibiting thermal remendablility and removability from multifunctional maleimide and furan compounds

Abstract: Crosslinked polymeric materials, which exhibit thermal remendability and removability through Diels–Alder (DA) and retro‐DA reactions, were obtained from using multifunctional maleimide and furan compounds as monomers. The synthesized monomers possess low melting points and good solubility in organo solvents to show excellent processing properties. The performance of DA and retro‐DA reactions were demonstrated with DSC and FTIR measurements. High performance of thermal remendablility and removability of the cr… Show more

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Cited by 241 publications
(168 citation statements)
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“…The presence of solvent inside the depth of scratch, accelerate the moieties mobility and heating induces the network to transform into rubbery phase and to fill it completely. [18] After filling the scratch, the moieties are still disconnected. Setting the temperature of sample at 65 8C favors the conditions for furan and maleimide to be re-connected and form the integral network.…”
Section: Thermo-remendability and Weldabilitymentioning
confidence: 99%
See 1 more Smart Citation
“…The presence of solvent inside the depth of scratch, accelerate the moieties mobility and heating induces the network to transform into rubbery phase and to fill it completely. [18] After filling the scratch, the moieties are still disconnected. Setting the temperature of sample at 65 8C favors the conditions for furan and maleimide to be re-connected and form the integral network.…”
Section: Thermo-remendability and Weldabilitymentioning
confidence: 99%
“…Indeed the T 50 , T max and the char yield of HDAN are much higher than those of DGEBA and it demonstrates higher thermal stability of HDAN. Herein, improved thermal stability of HDAN encompasses some causes: (i) self-addition and cross-linking reaction occurred between some free maleimide groups in the de-bonded sample to enhance its thermal stability and to reduce the amount of weight loss at temperature higher than 200-390 8C, [18] and (ii), thermally induced dehydration of DA adducts which favors the aromatization to form aromatic imide structures with high thermostability, (iii) release of gases such as H 2 O, [19] CO, CO 2 , CH 4 [20] and possibly NH 3 by aforementioned solid species under higher temperatures (~400-500 8C), to form thermostable components leading to a high char yield of~33% at 800 8C and (iv) pyrolitically transformation of PFA structure to aromatic species. [20] Superior thermal properties of HDAN, indicates that it can be an advanced sustainable network in harsh thermal conditions in future.…”
Section: Tgamentioning
confidence: 99%
“…175 Healing of polymers with structurally different multifuran and multimaleimide monomers has also been met with similar levels of success. [176][177][178] Murphy et al have developed a series of self-healing DA based monomers that use cyclopentadiene as both the diene and dienophile. In this novel approach, a macrocyclic derivative of DCPD, which is the DA adduct of two molecules of cyclopentadiene, was synthesised using several short organic linkers in such a way that the rDA reaction of the macrocycle would yield an a,v-bis(cyclopentadiene).…”
Section: Thermally Reversible Self-healingmentioning
confidence: 99%
“…[1][2][3][4][5][6] A potential NLO polymer has to be mechanically very strong and thermally stable with a high glass-transition temperature (Tg). In the developments of NLO polymers for electro-optic device applications, stabilization of electrically induced dipole alignment is one of important criteria; in this context, two approaches have been proposed to minimize the randomization of dipole alignment, namely the use cross-linking method [7][8][9][10] and the utilization of high T g polymers such as polyimides. [11][12][13][14][15][16] Various polyesters with NLO chromophores in the main chain 17 or in side chain [18][19] have been prepared and their properties studied.…”
Section: T T T (A)mentioning
confidence: 99%