The properties of thick GaN layers grown by metal organic chemical vapor deposition on 2 HVPE substrates were investigated. Although the epilayer is smooth on a microscopic scale with high quality layers as evidenced by X-ray diffraction and photoluminescence, macroscopic morphological variations are observed on the wafer surface. These variations correspond to disparities in leakage current in fabricated Schottky barrier diodes, with rougher macroscopic morphology resulting in increased leakage current. GaN-based technology has found widespread success in the electronic and optoelectronic fields, both as transistors and LEDs.1-3 These successes are mainly based on lateral device geometries or thin vertical structures based on heteroepitaxy on non-native substrates. While monolithic microwave integrated circuits (MMICs) based on high electron mobility transistor (HEMT) structures have enjoyed great success as RF power amplifiers, the lateral device geometry presents fundamental limitations, particularly for breakdown voltage, thus limiting applications for high power switching. [4][5][6][7][8] To overcome some of these limitations and reach the full potential of the material for power devices, the next-generation of GaN power switching devices needs to move to a vertical geometry, which is enabled by the commercial availability of high quality, freestanding GaN substrates produced by hydride vapor phase epitaxy (HVPE) or ammonothermal growth.
9Homoepitaxial growth of power device quality GaN films on native substrates presents unique challenges from preparing the surface for growth, both to remove impurities and reduce thermal decomposition, to reducing impurities in the film for thick drift layers. [10][11][12][13] This work will evaluate GaN films grown by MOCVD on HVPE substrates to understand the impact of surface roughness on Shcottky barrier diode performance to evaluate metrics for evaluating epitaxial layer quality and uniformity.The samples in this study were grown in an Emcore D-180 metal organic chemical vapor deposition (MOCVD) reactor on a commercially-sourced, 2 freestanding n+ GaN substrate from Kyma Technologies grown by HVPE. The MOCVD growth consisted of 5 μm of unintentionally doped GaN using standard growth conditions (3000 V/III, 200 Torr, 1030• C) and precursors (trimethylgallium and ammonia). Secondary ion mass spectroscopy (SIMS) measurements on films from this reactor under these growth conditions indicate background oxygen and carbon impurities at detection limits and a Si concentration of ∼2 × 10 16 cm −3 . As the substrate was received polished to an epi-ready surface, no additional in-situ or ex-situ cleaning procedures were undertaken. After growth, the surface morphology was characterized using multiple techniques to evaluate many length scales, including optical microscopy, atomic force microscopy (AFM), and optical profilometry. In addition, photoluminescence (PL), X-ray diffraction (XRD), and wafer bow were investigated to assess material quality.XRD maps were taken of the wafer...