Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method

Schöngrundner, R.; Treml, R.; Antretter, Thomas; Kozic, Darjan; Ecker, Werner; Kiener, Daniel; Brunner, Roland

doi:10.1016/j.tsf.2014.06.003

Cited by 51 publications

(28 citation statements)

References 45 publications

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“…The curvature method can measure the in-plane average residual stress of the coating, but not the local residual stress. The cantilever method is also used to measure the average residual stress [17]. However, the destruction of a coating often begins with a region with a localized defect or special topography areas [18,19].…”

Section: Of 11mentioning

confidence: 99%

Study on Local Residual Stress in a Nanocrystalline Cr2O3 Coating by Micro-Raman Spectroscopy

et al. 2019

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Residual stress in coatings often affects the service performance of coatings, and the residual stresses in some local areas even lead to premature failure of coatings. In this work, we characterized the residual stress of local micro-areas of a nanocrystalline Cr2O3 coating deposited on a Si wafer through micro-Raman spectroscopy, including the depositional edge zone where the electrode was placed, the micro-area containing Cr2O3 macroparticles, and other micro-areas vulnerable to cracks. To accurately measure the thickness of the coating, we combined optical interferometry and direct measurement by a profilometer. The results indicate the existence of in-plane tensile residual stress on the Cr2O3 coating. In thick coatings, the residual stress is independent of the coating thickness and is stable between 0.55 GPa and 0.75 GPa. As the coating thickness is less than 0.8 μm, the residual stress is directly related to the coating thickness. This in-plane tensile stress is considered as the origin of the observed microcrack, which can partially release the stress.

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Section: Of 11mentioning

confidence: 99%

Study on Local Residual Stress in a Nanocrystalline Cr2O3 Coating by Micro-Raman Spectroscopy

et al. 2019

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“…It was already demonstrated in Ref. 8 that the sample geometry influences the residual stress state and that the stresses relax for a decreased sample size. Therefore, the small samples investigated by shear testing facilitate stress relaxation and residual stresses can be neglected as the intrinsic interface toughness is examined.…”

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confidence: 87%

“…Therefore, these stresses were assessed first by means of the ion beam layer removal (ILR) method. [6][7][8] The locally resolved residual stress profiles for each of the investigated stacks can be found in Ref. 6.…”

mentioning

confidence: 99%

Selective interface toughness measurements of layered thin films

et al. 2017

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Driven by the ongoing miniaturization and increasing integration in microelectronics devices, very thin metallic films became ever more important in recent years. Accordingly also the capability of determining specific physical and mechanical properties of such arrangements gained increasing importance. Miniaturized testing methods to evaluate, for example, the mechanical properties of thin metallic multilayers are therefore indispensable. A novel in-situ micromechanical approach is examined in the current study and compared to existing methods regarding their capability to determine the interface toughness of specific interfaces in multilayer configurations. Namely, sputter deposited copper and tungsten thin films with a thickness of approx. 500 nm on a stress-free silicon (100) substrate are investigated. The multilayer stacks consist of different materials that vary in microstructure, elastic properties and residual stress state. We examine the interface toughness via double cantilever beam tests, nanoindentation and novel miniaturized shear tests. The choice of a proper test method is indispensable when addressing strong interfaces, such as the W-Cu interface, in the presence of weaker ones. Finally, it is demonstrated that miniaturized shear testing is a very promising approach to test such strong interfaces as the interface of interest to fail is predefined by the sample geometry.

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“…The deformation of a well-defined structure milled into a microscale feature of interest, allows the feature to be studied under a simple, quantifiable stress-state. For example, microcantilever (MC) bending has been used to investigate the elastic modulus [17], yield strength [18], fracture toughness [19,20], fatigue properties [21], and residual stress [22,23] of thin films. More recently, the fracture toughness of thin films and coatings have been assessed by means of micropillar splitting [24], double-cantilever compression [25], as well as three point bending of clamped bridges [26,27].…”

Section: Introductionmentioning

confidence: 99%

Inducing stable interfacial delamination in a multilayer system by four-point bending of microbridges

Mead

Huang

2017

Surface and Coatings Technology

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The ability to produce stable delamination of thin film multilayer interfaces is a powerful tool for studying the interfacial adhesion within microsystems. In this study, a technique involving the four-point bending of microbridges was applied to initiate stable interfacial delamination within a multilayer system. Microscale pre-notched bridges with clamped-ends were machined into an Al/SiN/GaAs multilayer using focus ion beam milling. A square flat-end indenter was used to induce bending of the bridge by two contact locations. Bridge failure occurred via substrate fracture at the pre-notch, followed by crack deflection, and stable interfacial delamination of the SiN/GaAs interface. Substrate fracture and delamination were identified within the obtained load-displacement curves as a pop-in and region of linear load reduction respectively.

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Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method

Cited by 51 publications

References 45 publications

Study on Local Residual Stress in a Nanocrystalline Cr2O3 Coating by Micro-Raman Spectroscopy

Study on Local Residual Stress in a Nanocrystalline Cr2O3 Coating by Micro-Raman Spectroscopy

Selective interface toughness measurements of layered thin films

Inducing stable interfacial delamination in a multilayer system by four-point bending of microbridges

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