Critical and Subcritical Adhesion Measurements of a Model Epoxy Coating Exposed to Moisture Using the Shaft-Loaded Blister Test

O'Brien, Emmett P.; Case, SW; Ward, T. C.

doi:10.1080/00218460590904444

Cited by 9 publications

(5 citation statements)

References 40 publications

(37 reference statements)

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“…This result has been discussed but is nowadays largely confirmed [41]. The explanation is that below 70% RH water remains in the polymeric networks and that above this value it condenses at the interface.…”

Section: Relative Humiditysupporting

confidence: 49%

Durability

Giannis¹,

Davies

Ameli

et al. 2012

Testing Adhesive Joints

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Section: Relative Humiditysupporting

confidence: 49%

Durability

Giannis¹,

Davies

Ameli

et al. 2012

Testing Adhesive Joints

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“…During the fracture tests, the samples were exposed to (a) deionized (DI) water, (b) aqueous 0.1 mol/L sodium chloride (NaCl), or (c) saturated (6.1 mol/L) NaCl solution. A similar protocol to that reported by O'Brien et al was used for assessing the impact of environmental factors on adhesion. For comparison, a “control” experiment in air was also conducted.…”

Section: Methodsmentioning

confidence: 99%

Role of salt on adhesion of an epoxy/aluminum (oxide) interface in aqueous environments

Tan¹,

White²,

Hunston³

et al. 2015

Polymer Engineering & Sci

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Joints held by polymeric adhesives are commonplace in many engineered products, but normal service can require exposure to environmental conditions that present a significant challenge for maintaining the structural integrity of the interface. In particular, aqueous environments can wreak havoc on the joint strength. Here, a mechanistic approach is used to understand the difference in the debonding behavior of an epoxy/aluminum (oxide) interface when exposed to deionized (DI) water and aqueous sodium chloride by correlating macroscopic failure with the sorption of salt and water into the adhesive and its nanoscale distribution. For the epoxy‐aluminum system examined here, the presence of sodium chloride increases the resistance to crack growth in comparison to DI water. The debonding appears to be controlled by water near the buried interface. Salt water decreases the solubility of water in the epoxy and decreases the concentration of water near the buried interface, but the concentration of salt that enters the epoxy is below the detection limit. Thus, even if ions cannot penetrate or sorb into the adhesive, the presence of salt can significantly alter the water distribution within the adhesive and ultimately the strength of the joint. POLYM. ENG. SCI., 56:18–26, 2016. © 2015 Society of Plastics Engineers

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“…Previous work suggested that the load-based equation is the preferred expression to calculate G due to the reduced effects of plastic deformation at the contact area and the insensitivity to changes in mechanical properties of the film [16,24] due to plasticization by fluid absorption. [23] However, in the presence of the slip-stick failure as observed for these samples, the displacement-based is the most appropriate expression to calculate G. Specimens were tested using loading and unloading cycles, which were repeated multiple times, to determine the crack length as a function of load and displacement (blister height). The uncertainty due to sample-to-sample variation is always equal to or greater than the uncertainty introduced by measuring the blister radius.…”

Section: Methodsmentioning

confidence: 99%

“…NR has been used to quantify the moisture content at the polymer/substrate interface for a series of substrate surfaces. The shaft-loaded blister test (SLBT) has been utilized to measure adhesion [16][17][18][19][20][21][22][23][24] and mechanical properties of the adhered thin films. [16,20,[25][26][27][28][29][30] Using neutron reflectivity and SLBT adhesion measurements, we investigate how surface chemistry influences the water content near the interface and the adhesive fracture energy after attaining an apparent equilibrium in either the dry (0 % relative humidity (rh.)…”

mentioning

confidence: 99%

Correlating Interfacial Moisture Content and Adhesive Fracture Energy of Polymer Coatings on Different Surfaces

2006

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Sn-Ag-Cu alloy. The Sn-Ag-Cu-Ge alloy solder ball had higher ball shear strength than the Sn-Ag-Cu alloy after an aging test at 150°C. The Sn-Ag-Cu-Ge alloy solder has better characteristics for both thermal oxidation and thermal reliability test. Therefore, it can be concluded that the Sn-Ag-Cu-Ge alloy is a good candidate to solve the oxidation problem, which is the most critical problem of the Pb-free solder. ExperimentalTwo solder ball compositions (in wt%) chosen in this study were : Sn3.0Ag0.5Cu and Sn3.0Ag0.5Cu0.05Ge, and had a diameter of 0.450 mm. The substrate used was CSP with 144 pad openings and each pad was 0.38 mm in diameter. The pads had an electroplated Ni/Au surface finish over Cu trace, with about 0.5 and 5.0 lm in thickness respectively. The solder balls from each composition were bonded to the CSP substrate using a water soluble flux under a reflow oven. The reflow condition is that preheating was done for 2 min at 150°C, the peak temperature was 235°C, and the dwell time was 60 sec.The solder balls after one were then analyzed or subjected to either multiple reflow up to 5 times or aging at 150°C for a duration up to 500 hs. XPS was utilized to check the oxide layer thickness and examine the surface chemical composition. We assumed that the oxide thickness can be defined by oxygen concentration under three atomic percent. The mechanical joint strength of the bonded balls was evaluated with Dage shear tester using a shear speed of 200 lm/s at a shear height of 10 lm.It is well known that ambient moisture and other environmental influences are detrimental to the adhesion of polymeric materials to metal surfaces. The primary reason why adhesion loss occurs is believed to be due to moisture accumulation at the polymer/metal interface. This is why adhesion loss does not generally correlate with the bulk moisture content of the polymer. In this work, we present measurements of the interfacial moisture content and adhesion for a series of polymer coatings having different surface chemistries. Measurements were made after reaching an apparent equilibrium in either a dry (0 % relative humidity) or wet (100 % relative humidity) environment. The loss of adhesion is found to correlate directly with interfacial water content. Surface treatments that resulted in a more hydrophilic surface lead to an increase in the interfacial water content and a decrease in interfacial fracture energy.Ambient moisture is well known to adversely affect the durability and performance of adhesive joints and coatings. [1] The interplay between the mechanical stress and chemical changes in the adhesive joint due to moisture adsorption is generally believed to be the root cause of failure of the adhesive application. Failure typically occurs at the polymer/metal interface, indicating that the primary mechanism for failure is not degradation of the bulk polymer. Instead, the structure of the coating near the interface is the determining factor in COMMUNICATIONS 114

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Critical and Subcritical Adhesion Measurements of a Model Epoxy Coating Exposed to Moisture Using the Shaft-Loaded Blister Test

Cited by 9 publications

References 40 publications

Durability

Durability

Role of salt on adhesion of an epoxy/aluminum (oxide) interface in aqueous environments

Correlating Interfacial Moisture Content and Adhesive Fracture Energy of Polymer Coatings on Different Surfaces

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