Creep Prediction of a Printed Wiring Board For Separable Land Grid Array Connector

Abstract

The paper presents a study of creep behavior of a printed wiring board caused by the mechanical fastening of separable connector, known as a land grid array. Time-temperature superposition method was employed to predict the lifetime creep behavior. A low-cost testing method based on the ASTM D790 three-point bending procedure was developed to predict and characterize creep of polymeric materials under low temperature, low stress, and large elapsed times.