The major objective of the present study was to investigate the creep fracture process of a copper tricrystal having ©110ª-tilt 3, 3, 9 grain boundaries. Creep tests at 0.81 T M (T M : melting temperature on the absolute temperature scale) under 4 MPa tensile stress were carried out for three samples prepared from the same tricrystal. Grain-boundary sliding occurred along only the 9 boundary, and the triple junction of the boundaries completely suppressed the sliding. The three samples were in different stages of creep deformation. Creep fracture was initiated by sliding-induced voids along the 9 boundary. Grain-boundary damage by the void formation developed into complete separation along the 9 boundary, and the 9 boundary crack induced surface grooves along one of the 3 boundaries, arranged almost perpendicular to the tensile axis. The crack propagation resulted in the final fracture of the tricrystal along the 9 and 3 boundaries. The formation of cavities in the 3 fracture surface suggested that the final fracture occurred in a ductile manner after the neighboring grains were partly separated along the 3 boundary.