Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales

Kerr, Matthew; Chawla, Nikhilesh

doi:10.1016/j.actamat.2004.06.010

Cited by 198 publications

(134 citation statements)

References 27 publications

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“…In fact, it has been observed that lattice diffusion in Sn alloys under stress becomes significant at temperatures >100°C, which correlates well with our observations. 42,43 XRD was conducted on the oxidized specimens in order to determine the oxide phases that were formed. According to the respective RE-O phase diagrams, 32 La 2 O 3 , CeO 2 , and Y 2 O 3 are expected to exist at ambient temperatures and pressure.…”

Section: Microstructure Evolution During Oxidationmentioning

confidence: 99%

Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders

Dudek

Chawla

2008

Journal of Elec Materi

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We have previously shown that small additions of the rare-earth (RE) element La to Sn-Ag-Cu alloys significantly increases their ductility, without significant loss in the overall strength. However, due to the high reactivity of La with oxygen, oxidation of the La-containing phases can affect the mechanical performance of the solder. In this work, we have investigated the effect of the addition of 2 wt.% Ce, La and Y on the oxidation behavior of Sn-3.9Ag-0.7Cu. Oxidation kinetics were established by heating samples in ambient air to 60°C, 95°C or 130°C for up to 250 h. Microstructural characterization of the samples, before and after oxidation, was conducted in order to determine the influence of RE-containing phases on the oxidation kinetics. The oxidation mechanism, including the phenomenon of Sn whiskering during oxidation, is also discussed.

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Section: Microstructure Evolution During Oxidationmentioning

confidence: 99%

Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders

Dudek

Chawla

2008

Journal of Elec Materi

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“…Furthermore, the SSA8030 produced very small SnSb IMCs (dark gray precipitates in Figure 9d) with some large SnSb IMCs after the creep test. For the precipitates of small size and round shape, their strength increases because they reduce the inter back stress formation and the dislocation movement [29]. Therefore, we measured the size and shape of Ag3Sn quantitatively and it is shown in Table 2.…”

Section: Discussionmentioning

confidence: 99%

The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders

Park

Bang

et al. 2017

Metals

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Solder joints are the main weak points of power modules used in harsh environments. For the power module of electric vehicles, the maximum operating temperature of a chip can reach 175 • C under driving conditions. Therefore, it is necessary to study the high-temperature reliability of solder joints. This study investigated the creep properties of Sn-3.0Ag-0.5Cu (SAC305) and Sn-8.0Sb-3.0Ag (SSA8030) solder joints. The creep test was conducted at 175 and 190 • C with the application of 2.45 MPa. The SAC305 solder had superior creep properties to those of SSA8030 solder at 175 • C and at largely the same homologous temperature (T H~0 .91 for SAC305 and T H~0 .92 for SSA8030). Both solders had primary β-Sn and a eutectic mixture of β-Sn and Ag 3 Sn. Compared to SSA8030, the SAC305 solder contained~10% more eutectic structure and contained Ag 3 Sn that was 3 times smaller and more round in shape. Furthermore, the SSA8030 solder precipitated SnSb in an elongated fiber shape (1-50 µm in size) after the creep test. Coarse and elongated Ag 3 Sn and SnSb of the SSA8030 solder negatively affected crack propagation in the dislocation creep region and decreased the creep resistance.

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“…27,29 However, systematic isothermal cycling experiments led at most to very limited, local recrystallization near the crack tip. 24,[30][31][32][33][34] In fact, Korhonen et al 34 conducted isothermal cycling experiments on single-crystal Sn3.8Ag0.7Cu samples at different temperatures ranging from À 25°C to 125°C, reproducing the strains and dwell times common in thermal cycling, without creating significant recrystallization. Recrystallization occurred more readily in solder joints with lower Ag concentrations, and thus greater average spacing between the Ag 3 Sn precipitates.…”

Section: Recrystallizationmentioning

confidence: 99%

A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints

Børgesen

Wentlent

Hamasha

et al. 2018

Journal of Elec Materi

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The present work offers both a complete, quantitative model and a conservative acceleration factor expression for the life span of SnAgCu solder joints in thermal cycling. A broad range of thermal cycling experiments, conducted over many years, has revealed a series of systematic trends that are not compatible with common damage functions or constitutive relations. Complementary mechanical testing and systematic studies of the evolution of the microstructure and damage have led to a fundamental understanding of the progression of thermal fatigue and failure. A special experiment was developed to allow the effective deconstruction of conventional thermal cycling experiments and the finalization of our model. According to this model, the evolution of damage and failure in thermal cycling is controlled by a continuous recrystallization process which is dominated by the coalescence and rotation of dislocation cell structures continuously added to during the hightemperature dwell. The dominance of this dynamic recrystallization contribution is not consistent with the common assumption of a correlation between the number of cycles to failure and the total work done on the solder joint in question in each cycle. It is, however, consistent with an apparent dependence on the work done during the high-temperature dwell. Importantly, the onset of this recrystallization is delayed by pinning on the Ag 3 Sn precipitates until these have coarsened sufficiently, leading to a model with two terms where one tends to dominate in service and the other in accelerated thermal cycling tests. Accumulation of damage under realistic service conditions with varying dwell temperatures and times is also addressed.

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Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales

Cited by 198 publications

References 27 publications

Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders

Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders

The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders

A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints

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