Creep crack growth in phosphorus alloyed oxygen free copper

Wu, Rong-Tsun; Sandström, Rolf; Jin, Lai-Zhe

doi:10.1016/j.msea.2013.06.046

Cited by 13 publications

(7 citation statements)

References 24 publications

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“…It has been shown that larger deformation occurs frequently in smaller grains in Cu-OFP. Creep cavities and cracks are often observed where large and small grains meet [24]. If Eqs.…”

Section: Grain Boundary Sliding Experimentsmentioning

confidence: 99%

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Grain boundary sliding in copper and its relation to cavity formation during creep

Sandström

Hagström

2016

Materials Science and Engineering: A

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“…It has been shown that larger deformation occurs frequently in smaller grains in Cu-OFP. Creep cavities and cracks are often observed where large and small grains meet [24]. If Eqs.…”

Section: Grain Boundary Sliding Experimentsmentioning

confidence: 99%

“…To provide an estimate of the maximum stresses that will appear in a creep exposed component, the stress that gives creep rupture after one year is shown in Fig. 12 , [24]. Longer rupture times should be considered, but such data do not exist at present.…”

Section: Application Of the Model To Cu-of And Cu-ofpmentioning

confidence: 99%

Grain boundary sliding in copper and its relation to cavity formation during creep

Sandström

Hagström

2016

Materials Science and Engineering: A

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“…It has been used to describe the creep rate in an approximate way as a function of stress for temperatures between 75 and 250 • C [2,19,20]. It has also been used for evaluating the creep rupture strength [21]. For oxygen free copper without phosphorus, the model takes the form .…”

Section: The Creep Mobilitymentioning

confidence: 99%

“…It has been verified by direct comparison to creep rate and creep strength data. But it has also been used to model, for example, creep ductility [18] and creep crack growth [21].…”

Section: The Creep Mobilitymentioning

confidence: 99%

The Role of Glide during Creep of Copper at Low Temperatures

Delandar

Sandström

Korzhavyi

2018

Metals

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Copper canister will be used in Scandinavia for final storage of spent nuclear fuel. The copper will be exposed to temperatures of up to 100 °C. The creep mechanism at near ambient temperatures has been assumed to be glide of dislocations, but this has never been verified for copper or other materials. In particular, no feasible mechanism for glide based static recovery has been proposed. To attack this classical problem, a glide mobility based on the assumption that it is controlled by the climb of the jogs on the dislocations is derived and shown that it is in agreement with observations. With dislocation dynamics (DD) simulations taking glide but not climb into account, it is demonstrated that creep based on glide alone can reach a quasi-stationary condition. This verifies that static recovery can occur just by glide. The DD simulations also show that the internal stress during creep in the loading direction is almost identical to the applied stress also directly after a load drop, which resolves further classical issues.

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“…Under these conditions, corrosion will lead to the formation of oxide layers on the Cu surface. [ 12,13 ] Presently available information indicates that the maximum depth of container corrosion due to O 2 consumption will be limited to 298 µm, as calculated using mass balance, conservatively assuming the corrosion product to be Cu 2 O only. Additionally, oxidants produced by H 2 O radiolysis could result in a further 10–30 µm penetration of the Cu coating.…”

Section: Introductionmentioning

confidence: 99%

The transition from used fuel container corrosion under oxic conditions to corrosion in an anoxic environment

Salehi Alaei,

Guo,

Chen

et al. 2023

Materials & Corrosion

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The conversion of copper oxide films on copper to copper sulfide has been investigated in sulfide‐containing chloride solutions. Single‐phase Cu2O films and duplex films consisting of Cu2O and CuO, and possibly Cu(OH)2, were prepared electrochemically on copper specimens at various applied potentials and characterized using Raman spectroscopy, scanning electron microscopy, and energy dispersive X‐ray analyses. The surface condition of the specimens subsequently exposed to a solution containing sulfide was monitored by measuring the corrosion potential (Ecorr) for various exposure periods, then cathodic stripping voltammetry was performed. Cuprite (Cu2O) was observed to be converted to Cu2S by chemical reaction with sulfide, while the conversion mechanism for the mixed deposit could comprise a galvanic process involving CuII reduction coupled to the formation of Cu2S by the reaction of sulfide with copper within pores in the Cu2O/CuO surface film and a chemical conversion of Cu2O to Cu2S. Cupric hydroxide was not converted to Cu2S on the time scale (24 h) of these experiments.

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Creep crack growth in phosphorus alloyed oxygen free copper

Cited by 13 publications

References 24 publications

Grain boundary sliding in copper and its relation to cavity formation during creep

Grain boundary sliding in copper and its relation to cavity formation during creep

The Role of Glide during Creep of Copper at Low Temperatures

The transition from used fuel container corrosion under oxic conditions to corrosion in an anoxic environment

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