Creep Behavior of Bi-Containing Lead-Free Solder Alloys

Witkin, David B.

doi:10.1007/s11664-011-1748-0

Cited by 51 publications

(13 citation statements)

References 40 publications

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“…by the addition of the (Ti) & (Cd) respectively. The creep characteristics (n & Q) are tabulated in Table 1, these values are complied with the reported value of (Sn-Ag) which is controlled by dislocation climb [29].…”

Section: Constitutive Creep Equation and Parameterssupporting

confidence: 79%

Structure analysis and enhancement of creep resistance and thermal properties of eutectic Sn-Ag lead free solder alloy by Ti and Cd - addition

Yassin

Khalifa

Ismail

2017

JAP

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Eutectic (Sn-3.5wt.%Ag) solder alloy is used in electronic circuits in which the creep property of the solder joints is essential for their applications. The study of creep, structure and thermal properties of three solder alloys (Sn-3.5wt.%Ag,Sn-3.5wt.%Ag-0.27wt.%Ti and Sn-3.5wt.Ag-0.27wt.%Cd) is characterized by the presence of (Ag3Sn-IMC) beside the phase (Î²-Sn). The microstructure parameters obtained from the X-ray analysis represented by, lattice parameters (a, c), the axial ratio (c/a), the residual strains (Î”a/a0, Î”c/c0) and peak height intensities (hkl) of some crystallographic planes are given. All parameters were found to be sensitive to the additions of (Ti or Cd), applied stresses and working temperatures in the range (298-373K).The crystallite size of the (211) reflection was found to increase from (61-132nm) with the additions and to decrease from (115-79nm) with the working temperatures. The morphological studies show a remarkable decrease in the size of (Î²-Sn) grains with the addition of (Cd) content which confirms the X-ray data. The obtained results show a decrease in melting temperature with the additions. The creep properties are notably improved by the addition of either (Ti) or (Cd). In order to reveal the creep characteristics such as stress exponent (n) and activation energy (Q), the tensile creep tests were performed within the temperature range (298-373K) at constant applied stress (17.27MPa). Based on the obtained stress exponents and activation energies, it is explained that the dominant deformation mechanism is dislocation climb over all temperature range.

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Section: Constitutive Creep Equation and Parameterssupporting

confidence: 79%

Structure analysis and enhancement of creep resistance and thermal properties of eutectic Sn-Ag lead free solder alloy by Ti and Cd - addition

Yassin

Khalifa

Ismail

2017

JAP

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“…by the addition of the (x-Ti wt.%), where (x = 0.25 -1.0wt.%). The creep characteristics (n and Q) values are complied with the reported value of (SnAg) which is controlled by dislocation climb [24,26].…”

Section: Figure 6: Linear Relationships Between (Lnε· and 1/t) For S1supporting

confidence: 76%

Influence of Low Ti-Element Additions on The Microstructure, Melting Properties and Creep Behavior of Sn-Ag-Cu Lead Free Solders

Yassin

Afify

Khalifa

2018

JAP

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Sn-3.5wt.%Ag-0.5wt.%Cu is one of the alloys considered for replacing SnPb solder alloys in electronic ambiance. In the present study, the effect of minor additions of Ti (0.25, 0.5, 1.0 wt.%) on the microstructure, creep and thermal properties of Sn-3.5wt.%Ag-0.5wt.%Cu lead free solder alloy are investigated by means of scanning electron microscopy (SEM), x-ray diffraction (XRD), creep tests and differential scanning calorimetry (DSC) thermal tests. Results showed that the addition of different wt.% of Ti refined the grain size of the solder alloys. The microstructure parameters obtained from x-ray analysis represented by lattice parameters (a,c), axial ratio (c/a), residual strains (?a/a? & ?c/c?), peak height intensities and crystallite size of some crystallographic planes were found to be sensitive to Ti - additions, applied stresses and working temperatures. The morphological studies using SEM showed refinements of Ag3Sn, Cu6Sn5 and Ti2Sn3 (IMCs) in ?-Sn matrix. Thermal analysis showed that Ti - additions slightly affect melting temperature and pastry range. In terms of creep behavior the addition of 1wt.%Ti gave the highest creep resistance with respect to the others, due to fine dispersion of IMCs. The stress exponents (n) and the activation energies (Q) indicated that the dominant creep mechanism is dislocation climb over all temperature ranges

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“…There are several Sn-Ag-Bi and Sn-Ag-Cu-Bi alloys which melt about 10°C lower than SAC305. The Bismuth in these solder compositions not only reduces the melting temperature, but also improves thermo mechanical behavior [2][3][4]. An additional benefit of using Bi-containing solder alloys is the possibility to reduce the propensity to whisker growth [5].…”

Section: Introductionmentioning

confidence: 99%

Manufacturability and Reliability Screening of Lower Melting Point, Pb-Free Alloys Containing Bismuth

Juarez¹,

Snugovsky²,

Kosiba³

et al. 2015

Journal of Microelectronics and Electronic Packaging

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This paper explores the manufacturability and reliability of three Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies. The first alloy included in the study is a Sn-based alloy with 3.4%Ag and 4.8%Bi, which showed promising results in the National Center for Manufacturing Sciences and German Joint projects. The other two alloy variations have reduced Ag content, with and without Cu. BGA and leaded components were assembled on medium-complexity test vehicles using these alloys, as well as SAC305 and SnPb as baseline alloys, for comparison. Test vehicles were manufactured using two board materials, 170°C glass transition temperature (Tg) and 155°C Tg, with three surface finishes: ENIG, ENEPIG, and OSP. The accelerated temperature cycling (ATC) testing was done at −55°C to 125°C with 30-min dwells and 10°C/min ramps, for 3,000 cycles. Detailed microstructure examination before and after ATC testing is described, as is failure analysis. All three experimental alloys showed excellent performance in harsh-environment thermal cycling. Vibration testing at two G-force test conditions with resistance failure monitoring was performed on the daisy-chained components. A detailed description of the technique for the vibration testing using 2 G and 5 G harmonic dwells is provided. The lowest failure rate found at both the 2 G and 5 G levels was for the Cu-containing alloy known as Violet. These results provide data for further statistical analysis leading to the choice of proper combinations of the solder alloys, board materials, and surface finishes for high-reliability applications.

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Creep Behavior of Bi-Containing Lead-Free Solder Alloys

Cited by 51 publications

References 40 publications

Structure analysis and enhancement of creep resistance and thermal properties of eutectic Sn-Ag lead free solder alloy by Ti and Cd - addition

Structure analysis and enhancement of creep resistance and thermal properties of eutectic Sn-Ag lead free solder alloy by Ti and Cd - addition

Influence of Low Ti-Element Additions on The Microstructure, Melting Properties and Creep Behavior of Sn-Ag-Cu Lead Free Solders

Manufacturability and Reliability Screening of Lower Melting Point, Pb-Free Alloys Containing Bismuth

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