Creating thermal conductive pathways in polymer matrix by directional assembly of synergistic fillers assisted by electric fields

Wu, Wei; Ren, Tianli; Liu, Xueqing; Davis, Ryan; Huai, Kai; Cui, Xin; Wei, Huaixiao; Hu, Jinjin; Xia, Yuming; Huang, Shuohan; Qiang, Zhe; Fu, Kun; Zhang, Jianming; Chen, Yuwei

doi:10.1016/j.coco.2022.101309

Cited by 19 publications

(9 citation statements)

References 36 publications

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“…The thermal conductivity of the 40 BN/Al2O3, 40 BN, and 45 BN/Al2O3 composites were measured at 0.68, 0.62, and 0.98 W/(m•K) (Figure 7b), respectively, which was in keeping with the thermal management behavior of these three samples in Figure 7a. As reported in the previous work [33], the thermal conductivity of the pure PDMS material was measured at 0.19 W/(m•K). Therefore, it could be concluded that the BN nanoflakes showed an obvious positive influence on the thermal conductive performance of PDMS material.…”

Section: Thermal Conductivity Of Composite Materialsmentioning

confidence: 91%

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DIW-Printed Thermal Management PDMS Composites with 3D Structural Thermal Conductive Network of h-BN Platelets and Al2O3 Nanoparticles

Zhu,

Wu,

Tang

et al. 2024

Polymers

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Electronic devices play an increasingly vital role in modern society, and heat accumulation is a major concern during device development, which causes strong market demand for thermal conductivity materials and components. In this paper, a novel thermal conductive material consisting of polydimethylsiloxane (PDMS) and a binary filler system of h-BN platelets and Al2O3 nanoparticles was successfully fabricated using direct ink writing (DIW) 3D printing technology. The addictive manufacturing process not only endows the DIW-printed composites with various geometries but also promotes the construction of a 3D structural thermal conductive network through the shearing force during the printing process. Moreover, the integrity of the thermal conductive network can be optimized by filling the gaps between the BN platelets with Al2O3 particles. Resultingly, the configuration of the binary fillers is arranged by the shearing force during the DIW process, fabricating the thermal conductive network of oriented fillers. The DIW-printed BN/Al2O3/PDMS with 45 wt% thermal conductive binary filler can reach a thermal conductivity of 0.98 W/(m·K), higher than the 0.62 W/(m·K) of the control sample. In this study, a novel strategy for the thermal conductive performance improvement of composites based on DIW technology is successfully verified, paving a new way for thermal management.

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Section: Thermal Conductivity Of Composite Materialsmentioning

confidence: 91%

“…As depicted in the XRD pattern, there is a distinct sharp peak at 27 • , indicating the typical crystal structure of BN nanoflakes [32]. The degree of orientation δ was taken and calculated using Equation (2) according to the previous relevant work [33]:…”

Section: Bn Orientation Analysis Of Compositesmentioning

confidence: 99%

DIW-Printed Thermal Management PDMS Composites with 3D Structural Thermal Conductive Network of h-BN Platelets and Al2O3 Nanoparticles

Zhu,

Wu,

Tang

et al. 2024

Polymers

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“…The thermal conductivity of the composite film with 30 wt% FeCo and 50 wt% BN fillers is 2.25 W m −1 K −1 . Wu et al 67 induced by an electric field, as shown in Figure 8, used micron‐scale boron nitride (BN) and nano‐scale alumina (Al 2 O 3 ) to create a thermal conductivity pathway in polydimethylsiloxane (PDMS) matrix. The directional assembly of the two fillers under the action of the electric field can further improve the thermal conductivity.…”

Section: Establishment Of Thermal Networkmentioning

confidence: 99%

A review: From the whole process of making thermal conductive polymer, the effective method of improving thermal conductivity

Wu,

Zhang,

Yan

et al. 2024

Journal of Polymer Science

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With the development of high power‐density electronic devices on smaller scales and emerging new energy vehicles, high thermal conductive materials have attracted more attention for better thermal management to adapt to various applications. By combining both the advantages of polymer materials and thermally conductive fillers, thermal conductive polymer composite materials are widely used in packaging and the protection of electronic devices for their mechanical robustness, high thermal conductivity, excellent insulation properties, heat resistance, and chemical resistance. In this review, first, the basic theory of heat conduction of polymer composites is discussed. Second, according to the classification of the composition of the thermal conductive polymer, the filled thermal conductive material is emphatically introduced. In this paper, the construction process of a thermal conductive network of polymer and composites is discussed from the perspective of processing. The simple construction of a thermal conductive network includes core‐shell structure, external force orientation, electrostatic spinning, electrostatic spraying, induced orientation, and vacuum‐assisted filtration. The three‐dimensional thermal conductivity network can be constructed using self‐assembly and template methods. From the above processing methods, this paper analyzes how to effectively improve thermal conductivity and achieve the goal of high thermal conductivity and excellent mechanical properties under low filling. After that, the contribution of filler and polymer modification to thermal conductivity is explained in detail. Finally, the future research direction of functionalization is prospected.

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“…Guo et al [ 47 ] utilized a gradient temperature field to fabricate alternating layers of GO and BN through an ice-template method, achieving a polyimide composite with an in-plane thermal conductivity of 1.49 W/m·K at a filler loading of 3.8 wt%. Wu et al [ 48 ] engineered a thermal pathway combining micro-scale BN and nano-scale alumina within poly(dimethylsiloxane) using an electric field, resulting in an in-plane thermal conductivity of 0.228 W/m·K. Yuan et al [ 23 ] aligned FeCo-BN vertically within poly(dimethylsiloxane) under magnetic field, obtaining a thermal conductivity of 2.25 W/m·K with a filler composition of 30 wt% FeCo and 50 wt% BN.…”

Section: Introductionmentioning

confidence: 99%

Enhancing Thermal Conductivity in Polymer Composites through Molding-Assisted Orientation of Boron Nitride

Liu,

Gong,

Liu

et al. 2024

Polymers

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Incrementing thermal conductivity in polymer composites through the incorporation of inorganic thermally conductive fillers is typically constrained by the requirement of high filler content. This necessity often complicates processing and adversely affects mechanical properties. This study presents the fabrication of a polystyrene (PS)/boron nitride (BN) composite exhibiting elevated thermal conductivity with a modest 10 wt% BN content, achieved through optimized compression molding. Adjustments to molding parameters, including molding-cycle numbers, temperature, and pressure, were explored. The molding process, conducted above the glass transition temperature of PS, facilitated orientational alignment of BN within the PS matrix predominantly in the in-plane direction. This orientation, achieved at low filler loading, resulted in a threefold enhancement of thermal conductivity following a single molding time. Furthermore, the in-plane alignment of BN within the PS matrix was found to intensify with increased molding time and pressure, markedly boosting the in-plane thermal conductivity of the PS/BN molded composites. Within the range of molding parameters examined, the highest thermal conductivity (1.6 W/m·K) was observed in PS/BN composites subjected to five molding cycles at 140 °C and 10 MPa, without compromising mechanical properties. This study suggests that compression molding, which allows low filler content and straightforward operation, offers a viable approach for the mass production of polymer composites with superior thermal conductivity.

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Creating thermal conductive pathways in polymer matrix by directional assembly of synergistic fillers assisted by electric fields

Cited by 19 publications

References 36 publications

DIW-Printed Thermal Management PDMS Composites with 3D Structural Thermal Conductive Network of h-BN Platelets and Al2O3 Nanoparticles

DIW-Printed Thermal Management PDMS Composites with 3D Structural Thermal Conductive Network of h-BN Platelets and Al2O3 Nanoparticles

A review: From the whole process of making thermal conductive polymer, the effective method of improving thermal conductivity

Enhancing Thermal Conductivity in Polymer Composites through Molding-Assisted Orientation of Boron Nitride

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