Creating multi-port thermal network models of LED luminaires for application in system level multi-domain simulation using spice-like solvers

Poppe, A.; Hegedüs, János; Szalai, Albin; Bornoff, Robin; Dyson, J.

doi:10.1109/semi-therm.2016.7458444

Cited by 13 publications

(15 citation statements)

References 11 publications

(25 reference statements)

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“…Though in this paper D. Schweitzer provides a general formulation of the problem and he established a terminology that we also try to follow in our present work, no mentioning of a compact thermal modeling methodology is given which is aimed at the description of multi heat-source problems with any geometrical arrangement and is not restricted to semiconductor device packages. Inspired by this paper as well as by our prior work in the field of electrothermal simulation of analog ICs given by their layout [11], we recently reported about a systematic approach of creating a steady-state compact thermal model of an LED based streetlighting luminaire [12,13]. In the meanwhile, L. Codecasa et al [14,15] reported on model order reduction methods (implemented in an academic software tool [16]) which are aimed for creating dynamic compact thermal models of multi heat-source systems described by any kind of detailed geometry.…”

Section: Introductionmentioning

confidence: 91%

Parametric Models of Thermal Transfer Impedances within a Successive Node Reduction Based Thermal Simulation Environment

Németh

Poppe

2018

Period. Polytech. Elec. Eng. Comp. Sci.

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In this paper we present a new, direct computational method for calculating thermal transfer impedances between two separate locations of a given physical structure, aimed at the implementation into a field-solver based on the SUNRED (SUccessive Node REDuction) algorithm.We tested the method symbolically with a simple 2D example with multiple combinations of Dirichlet and Neumann type boundary conditions. Also, for time domain transient analysis different types of thermal loads such as prescribed unit-step change in dissipation or temperature were assumed. A model of a typical MCPCB assembled LED was also created. With that model we studied the inverse problem of predicting the thermal conditions at the junction (the "driving point") from the transient signal measured at the thermal test point on the MCPCB (the "monitoring point") which is a typical task in simple LED thermal management designs. Results obtained by the proposed new calculation method and results obtained by conventional numerical simulations differ less than the uncertainty of the traditional solution method itself. The drawback of the accuracy is the high computational cost. This increased computational need can be mitigated by introducing the combination of the balanced model reduction and the SUNRED algorithms. Keywords

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Section: Introductionmentioning

confidence: 91%

Parametric Models of Thermal Transfer Impedances within a Successive Node Reduction Based Thermal Simulation Environment

Németh

Poppe

2018

Period. Polytech. Elec. Eng. Comp. Sci.

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“…Poppe et al described die level modelling and integration with package modelling, up to a system level compact model of a complete luminaire [20,21]. In the subsequent subsection, following the bottom-up hierarchy shown in Figure 3, we present, how this earlier concept was implemented in the Delphi4LED design flow.…”

Section: Creation Of the Led Digital Twinmentioning

confidence: 99%

“…These are later used in luminaire level analysis (following the hierarchical approach proposed in [20] and [21]) as the actual digital twins of the LED packages representing their true thermal behavior.…”

Section: Digital Twin Of the Led Packagementioning

confidence: 99%

Luminaire Digital Design Flow with Multi-Domain Digital Twins of LEDs

Martin

Marty²,

Bornoff

et al. 2019

Energies

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At present, when designing a Light Emitting Diode (LED) luminaire, different strategies of development are followed depending on the size of the company. Since on LED datasheets there is only limited information provided, companies designing LED luminaires spend a lot of effort gathering the required input of LED details to be able to design reliable products. Small and medium size enterprises (SMEs) do not have the bandwidth to gather such input and solely rely on empirical approaches leading to approximated luminaire designs, while larger companies use advanced hardware and software tools to characterize parts, design versions, and finally optimize all design steps. In both cases, considerable time and money is spent on prototyping, sampling, and laboratory testing. Digitalization of the complete product development (also known as Industry 4.0 approach) at all integration levels of the solid state lighting (SSL) supply chain would provide the remedy for these pains. The Delphi4LED European project aimed at developing multi-domain compact models of LED (for a consistent, combined description of electronic, thermal, and optical properties of LEDs) as digital twins of the physical products to support virtual prototyping during the design of luminaires. This paper provides an overview of the Delphi4LED approach aimed at supporting new, completely digital workflows both for SMEs and larger companies (Majors) along with some comparison with the traditional luminaire design. Two demonstration experiments are described: One to show the achievable benefits of the approach and another one to demonstrate the ease of use and ability to be accommodated in a larger scale product design for assessing design choices like e.g., number and type of LEDs versus electrical/thermal conditions and constraints, in a tool agnostic manner.

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“…In the bottom-up modular approach, the modelling starts from a multi-domain model of LED chips [5][6][7], followed by compact thermal models of the LED packages, modules (orange framed items in Figure 1), and finally, luminaires [8,9]. Details of the compact modelling of the 3D thermal environment of LED chips (package, substrate, luminaire with optics) are provided in other publications, such as [8,10,11].…”

Section: The Context Of This Workmentioning

confidence: 99%

Multi-Domain Modelling of LEDs for Supporting Virtual Prototyping of Luminaires

et al. 2019

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This paper presents our approaches to chip level multi-domain LED (light emitting diode) modelling, targeting luminaire design in the Industry 4.0 era, to support virtual prototyping of LED luminaires through luminaire level multi-domain simulations. The primary goal of such virtual prototypes is to predict the light output characteristics of LED luminaires under different operating conditions. The key component in such digital twins of a luminaire is an appropriate multi-domain model for packaged LED devices that captures the electrical, thermal, and light output characteristics and their mutual dependence simultaneously and consistently. We developed two such models with this goal in mind that are presented in detail in this paper. The first model is a semi analytical, quasi black-box model that can be implemented on the basis of the built-in diode models of spice-like circuit simulators and a few added controlled sources. Our second presented model is derived from the physics of the operation of today’s power LEDs realized with multiple quantum well heterojunction structures. Both models have been implemented in the form of visual basic macros as well as circuit models suitable for usual spice circuit simulators. The primary test bench for the two circuit models was an LTspice simulation environment. Then, to support the design of different demonstrator luminaires of the Delphi4LED project, a spreadsheet application was developed, which ensured seamless integration of the two models with additional models representing the LED chips’ thermal environment in a luminaire. The usability of our proposed models is demonstrated by real design case studies during which simulated light output characteristics (such as hot lumens) were confirmed by luminaire level physical tests.

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Creating multi-port thermal network models of LED luminaires for application in system level multi-domain simulation using spice-like solvers

Cited by 13 publications

References 11 publications

Parametric Models of Thermal Transfer Impedances within a Successive Node Reduction Based Thermal Simulation Environment

Parametric Models of Thermal Transfer Impedances within a Successive Node Reduction Based Thermal Simulation Environment

Luminaire Digital Design Flow with Multi-Domain Digital Twins of LEDs

Multi-Domain Modelling of LEDs for Supporting Virtual Prototyping of Luminaires

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