2011
DOI: 10.1016/j.microrel.2011.05.011
|View full text |Cite
|
Sign up to set email alerts
|

Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

0
11
0

Year Published

2014
2014
2021
2021

Publication Types

Select...
6
2

Relationship

0
8

Authors

Journals

citations
Cited by 23 publications
(11 citation statements)
references
References 21 publications
0
11
0
Order By: Relevance
“…. A simpler way is to use bond-based peridynamic approaches (Silling and Askari 2005;Silling et al 2007), which leads to valuable results in various fields, such electronic devices durability (Agwai et al 2011) and fibre-reinforced composites fractures (Hu et al 2012), concrete failure mechanics (Gerstle et al 2007), polycrystal fracture (Askari et al 2008) and nanoscale rupture mechanics (Bobaru 2007;Celik et al 2011). In such models, opposite forces of the same magnitude are exerted through a deformed bond, ξ !…”
Section: Peridynamic Approachmentioning
confidence: 99%
“…. A simpler way is to use bond-based peridynamic approaches (Silling and Askari 2005;Silling et al 2007), which leads to valuable results in various fields, such electronic devices durability (Agwai et al 2011) and fibre-reinforced composites fractures (Hu et al 2012), concrete failure mechanics (Gerstle et al 2007), polycrystal fracture (Askari et al 2008) and nanoscale rupture mechanics (Bobaru 2007;Celik et al 2011). In such models, opposite forces of the same magnitude are exerted through a deformed bond, ξ !…”
Section: Peridynamic Approachmentioning
confidence: 99%
“…Because of the mathematical simplicity and computational affordability, peridynamics has been used to analyze various computationally intense problems, such as dynamic fracture in brittle [Ha and Bobaru 2010;Liu and Hong 2012;Lipton 2014] and composite [Askari et al 2006;Xu et al 2008;Kilic et al 2009;Hu et al 2011; materials, multiscale damage Alali and Lipton 2012], and damage of nanofiber networks, including long-range effects of van der Waals forces on nanofiber deformation [Bobaru and Silling 2004;Bobaru 2007;. Moreover, peridynamics has been used in failure analyses dealing with thin film cracking in electronic packaging [Agwai et al 2008; and also in conjunction with atomic force microscopy and nanoindentation techniques to determine the mechanical properties of ultrathin films [Celik et al 2009].…”
Section: Introductionmentioning
confidence: 99%
“…The development of viscoelastic peridynamic equation is mainly about substituting viscoelastic material properties (3) into material constant c 1 in the peridynamic bond force equation (2). In this current work, the constant c 2 (temperature properties) is neglected since the temperature is made constant (ambient temperature).…”
Section: Methodsmentioning
confidence: 99%
“…From the stress, the force can be obtained (4). By arranging the force as a subject, the bond force equation is obtained (5) and it can be put into bond force equation, replacing the 'c 1 s' (2). The significant difference between elastic and viscoelastic bond force equation is the additional time parameter in the viscoelastic equation.…”
Section: Methodsmentioning
confidence: 99%